JPS532183B2 - - Google Patents

Info

Publication number
JPS532183B2
JPS532183B2 JP11906873A JP11906873A JPS532183B2 JP S532183 B2 JPS532183 B2 JP S532183B2 JP 11906873 A JP11906873 A JP 11906873A JP 11906873 A JP11906873 A JP 11906873A JP S532183 B2 JPS532183 B2 JP S532183B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11906873A
Other languages
Japanese (ja)
Other versions
JPS4977979A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4977979A publication Critical patent/JPS4977979A/ja
Publication of JPS532183B2 publication Critical patent/JPS532183B2/ja
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/10Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/20Inorganic coating
    • B32B2255/205Metallic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/24Aluminium
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP11906873A 1972-11-03 1973-10-24 Expired JPS532183B2 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30336972A 1972-11-03 1972-11-03

Publications (2)

Publication Number Publication Date
JPS4977979A JPS4977979A (enrdf_load_stackoverflow) 1974-07-26
JPS532183B2 true JPS532183B2 (enrdf_load_stackoverflow) 1978-01-26

Family

ID=23171773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11906873A Expired JPS532183B2 (enrdf_load_stackoverflow) 1972-11-03 1973-10-24

Country Status (9)

Country Link
JP (1) JPS532183B2 (enrdf_load_stackoverflow)
BE (1) BE806513A (enrdf_load_stackoverflow)
DE (1) DE2351672A1 (enrdf_load_stackoverflow)
ES (1) ES420191A1 (enrdf_load_stackoverflow)
FR (1) FR2205415B1 (enrdf_load_stackoverflow)
GB (1) GB1432218A (enrdf_load_stackoverflow)
IL (1) IL43087A (enrdf_load_stackoverflow)
IT (1) IT994788B (enrdf_load_stackoverflow)
NL (1) NL7314645A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL43636A (en) * 1973-03-23 1977-05-31 Macdermid Inc Plastic-metal laminate and a method for its manufacture
US4400100A (en) * 1981-03-02 1983-08-23 International Business Machines Corp. Four layered ribbon for electrothermal printing
US5470622A (en) * 1990-11-06 1995-11-28 Raychem Corporation Enclosing a substrate with a heat-recoverable article
DE4238242C2 (de) * 1992-09-17 2003-04-24 Rieger Franz Metallveredelung Verfahren zur Vorbehandlung von Leichtmetallen nach Patent DE 4231052 C2

Also Published As

Publication number Publication date
IL43087A0 (en) 1973-11-28
ES420191A1 (es) 1976-07-01
FR2205415A1 (enrdf_load_stackoverflow) 1974-05-31
IL43087A (en) 1976-11-30
IT994788B (it) 1975-10-20
BE806513A (fr) 1974-04-25
JPS4977979A (enrdf_load_stackoverflow) 1974-07-26
DE2351672A1 (de) 1974-05-16
AU5972173A (en) 1975-03-06
NL7314645A (enrdf_load_stackoverflow) 1974-05-07
GB1432218A (en) 1976-04-14
FR2205415B1 (enrdf_load_stackoverflow) 1977-05-27

Similar Documents

Publication Publication Date Title
JPS5632164B2 (enrdf_load_stackoverflow)
FR2207117A1 (enrdf_load_stackoverflow)
FR2205415B1 (enrdf_load_stackoverflow)
JPS4947941A (enrdf_load_stackoverflow)
FR2198919B1 (enrdf_load_stackoverflow)
JPS4938056A (enrdf_load_stackoverflow)
JPS4958376A (enrdf_load_stackoverflow)
JPS5151548Y2 (enrdf_load_stackoverflow)
JPS48102539A (enrdf_load_stackoverflow)
JPS4910371U (enrdf_load_stackoverflow)
JPS523368Y2 (enrdf_load_stackoverflow)
JPS5221436Y2 (enrdf_load_stackoverflow)
JPS5118535B2 (enrdf_load_stackoverflow)
JPS4980176U (enrdf_load_stackoverflow)
CH571004A5 (enrdf_load_stackoverflow)
CH566179A5 (enrdf_load_stackoverflow)
PL83626B1 (enrdf_load_stackoverflow)
SE7110355L (enrdf_load_stackoverflow)
CH566000A5 (enrdf_load_stackoverflow)
CH571379A5 (enrdf_load_stackoverflow)
CH571182A5 (enrdf_load_stackoverflow)
CH565694A5 (enrdf_load_stackoverflow)
CH570745A5 (enrdf_load_stackoverflow)
CH569758A5 (enrdf_load_stackoverflow)
CH568173A5 (enrdf_load_stackoverflow)