GB1432218A - Method of treating a plastics substrate for the subsequent bonding thereto of a metal coating - Google Patents
Method of treating a plastics substrate for the subsequent bonding thereto of a metal coatingInfo
- Publication number
- GB1432218A GB1432218A GB5127973A GB5127973A GB1432218A GB 1432218 A GB1432218 A GB 1432218A GB 5127973 A GB5127973 A GB 5127973A GB 5127973 A GB5127973 A GB 5127973A GB 1432218 A GB1432218 A GB 1432218A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- anodised
- metal foil
- sacrificial
- plastics substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
1432218 Coated products MACDERMID INC 5 Nov 1973 [3 Nov 1972] 51279/73 Heading B2E [Also in Division C7] A plastics substrate to be bonded to a metal coating is pretreated by forming a laminate of the plastics substrate and a sacrificial anodised metal foil by bonding the substrate and the sacrificial anodised metal together under heat and pressure, an organic silicon compound being provided between the anodised metal foil and the substrate and chemically stripping the sacrificial metal foil from the laminate. The anodised metal foil may be aluminium foil which has been anodised in phosphoric acid solution or sulphuric acid solution. Numerous suitable organic silicon compounds are specified, and gamma-aminopropyl trimethoxy silane and N-beta-(aminoethyl)-gamma-amino-propyl trimethoxy silane are preferred. The plastics substrate may be of a "filled" polymer, whioh is made by blending into the polymer during a moulding operation particles of titanium dioxide, asbestos or sand. In the Examples glassreinforced epoxy resins are used. Prior to the removal of the sacrificial metal foil the substrate is ready for metal plating and in the Example this is effected by imersing the substrate in a palladium-stannous chloride hydrosol activator solution.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US30336972A | 1972-11-03 | 1972-11-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1432218A true GB1432218A (en) | 1976-04-14 |
Family
ID=23171773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5127973A Expired GB1432218A (en) | 1972-11-03 | 1973-11-05 | Method of treating a plastics substrate for the subsequent bonding thereto of a metal coating |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS532183B2 (en) |
BE (1) | BE806513A (en) |
DE (1) | DE2351672A1 (en) |
ES (1) | ES420191A1 (en) |
FR (1) | FR2205415B1 (en) |
GB (1) | GB1432218A (en) |
IL (1) | IL43087A (en) |
IT (1) | IT994788B (en) |
NL (1) | NL7314645A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2271578A (en) * | 1992-09-17 | 1994-04-20 | Rieger Franz Metallveredelung | Pretreatment of light metals with phosphoric acid; electroless deposition |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL43636A (en) * | 1973-03-23 | 1977-05-31 | Macdermid Inc | Plastic-metal laminate and a method for its manufacture |
US4400100A (en) * | 1981-03-02 | 1983-08-23 | International Business Machines Corp. | Four layered ribbon for electrothermal printing |
US5470622A (en) * | 1990-11-06 | 1995-11-28 | Raychem Corporation | Enclosing a substrate with a heat-recoverable article |
-
1973
- 1973-08-27 IL IL43087A patent/IL43087A/en unknown
- 1973-10-15 DE DE19732351672 patent/DE2351672A1/en active Pending
- 1973-10-17 IT IT53188/73A patent/IT994788B/en active
- 1973-10-22 FR FR7337621A patent/FR2205415B1/fr not_active Expired
- 1973-10-24 NL NL7314645A patent/NL7314645A/xx not_active Application Discontinuation
- 1973-10-24 JP JP11906873A patent/JPS532183B2/ja not_active Expired
- 1973-10-25 BE BE137063A patent/BE806513A/en unknown
- 1973-11-02 ES ES420191A patent/ES420191A1/en not_active Expired
- 1973-11-05 GB GB5127973A patent/GB1432218A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2271578A (en) * | 1992-09-17 | 1994-04-20 | Rieger Franz Metallveredelung | Pretreatment of light metals with phosphoric acid; electroless deposition |
GB2271578B (en) * | 1992-09-17 | 1996-09-18 | Rieger Franz Metallveredelung | Bath for the pre-treatment of light metals,process therefor and articles produced |
Also Published As
Publication number | Publication date |
---|---|
DE2351672A1 (en) | 1974-05-16 |
JPS4977979A (en) | 1974-07-26 |
NL7314645A (en) | 1974-05-07 |
AU5972173A (en) | 1975-03-06 |
IL43087A (en) | 1976-11-30 |
IT994788B (en) | 1975-10-20 |
IL43087A0 (en) | 1973-11-28 |
BE806513A (en) | 1974-04-25 |
FR2205415A1 (en) | 1974-05-31 |
JPS532183B2 (en) | 1978-01-26 |
FR2205415B1 (en) | 1977-05-27 |
ES420191A1 (en) | 1976-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |