JPS53143973A - Method of producing thick film ic - Google Patents

Method of producing thick film ic

Info

Publication number
JPS53143973A
JPS53143973A JP5895477A JP5895477A JPS53143973A JP S53143973 A JPS53143973 A JP S53143973A JP 5895477 A JP5895477 A JP 5895477A JP 5895477 A JP5895477 A JP 5895477A JP S53143973 A JPS53143973 A JP S53143973A
Authority
JP
Japan
Prior art keywords
thick film
producing thick
producing
film
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5895477A
Other languages
Japanese (ja)
Other versions
JPS588587B2 (en
Inventor
Hitoshi Toda
Masayuki Katagiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP52058954A priority Critical patent/JPS588587B2/en
Publication of JPS53143973A publication Critical patent/JPS53143973A/en
Publication of JPS588587B2 publication Critical patent/JPS588587B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP52058954A 1977-05-21 1977-05-21 Method for manufacturing thick film integrated circuit device Expired JPS588587B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52058954A JPS588587B2 (en) 1977-05-21 1977-05-21 Method for manufacturing thick film integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52058954A JPS588587B2 (en) 1977-05-21 1977-05-21 Method for manufacturing thick film integrated circuit device

Publications (2)

Publication Number Publication Date
JPS53143973A true JPS53143973A (en) 1978-12-14
JPS588587B2 JPS588587B2 (en) 1983-02-16

Family

ID=13099221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52058954A Expired JPS588587B2 (en) 1977-05-21 1977-05-21 Method for manufacturing thick film integrated circuit device

Country Status (1)

Country Link
JP (1) JPS588587B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59232485A (en) * 1983-06-15 1984-12-27 株式会社日立製作所 Thick film circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59232485A (en) * 1983-06-15 1984-12-27 株式会社日立製作所 Thick film circuit board

Also Published As

Publication number Publication date
JPS588587B2 (en) 1983-02-16

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