JPS53143566U - - Google Patents

Info

Publication number
JPS53143566U
JPS53143566U JP4922977U JP4922977U JPS53143566U JP S53143566 U JPS53143566 U JP S53143566U JP 4922977 U JP4922977 U JP 4922977U JP 4922977 U JP4922977 U JP 4922977U JP S53143566 U JPS53143566 U JP S53143566U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4922977U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4922977U priority Critical patent/JPS53143566U/ja
Publication of JPS53143566U publication Critical patent/JPS53143566U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83192Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385Shape, e.g. interlocking features

Landscapes

  • Die Bonding (AREA)
JP4922977U 1977-04-18 1977-04-18 Pending JPS53143566U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4922977U JPS53143566U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-04-18 1977-04-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4922977U JPS53143566U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-04-18 1977-04-18

Publications (1)

Publication Number Publication Date
JPS53143566U true JPS53143566U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-11-13

Family

ID=28934427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4922977U Pending JPS53143566U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-04-18 1977-04-18

Country Status (1)

Country Link
JP (1) JPS53143566U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109294A (ja) * 2013-12-03 2015-06-11 三菱電機株式会社 電力用半導体装置およびその製造方法
JP2015205335A (ja) * 2014-04-23 2015-11-19 アイシン精機株式会社 レーザ接合方法、レーザ接合品及びレーザ接合装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109294A (ja) * 2013-12-03 2015-06-11 三菱電機株式会社 電力用半導体装置およびその製造方法
JP2015205335A (ja) * 2014-04-23 2015-11-19 アイシン精機株式会社 レーザ接合方法、レーザ接合品及びレーザ接合装置

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