JPS53140049U - - Google Patents
Info
- Publication number
- JPS53140049U JPS53140049U JP1977045330U JP4533077U JPS53140049U JP S53140049 U JPS53140049 U JP S53140049U JP 1977045330 U JP1977045330 U JP 1977045330U JP 4533077 U JP4533077 U JP 4533077U JP S53140049 U JPS53140049 U JP S53140049U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977045330U JPS53140049U (enrdf_load_stackoverflow) | 1977-04-13 | 1977-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977045330U JPS53140049U (enrdf_load_stackoverflow) | 1977-04-13 | 1977-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS53140049U true JPS53140049U (enrdf_load_stackoverflow) | 1978-11-06 |
Family
ID=28923384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977045330U Pending JPS53140049U (enrdf_load_stackoverflow) | 1977-04-13 | 1977-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53140049U (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5596658A (en) * | 1979-01-19 | 1980-07-23 | Nec Corp | Semiconductor container |
| JPS57143837A (en) * | 1981-02-27 | 1982-09-06 | Sharp Corp | Positioning of bonder |
-
1977
- 1977-04-13 JP JP1977045330U patent/JPS53140049U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5596658A (en) * | 1979-01-19 | 1980-07-23 | Nec Corp | Semiconductor container |
| JPS57143837A (en) * | 1981-02-27 | 1982-09-06 | Sharp Corp | Positioning of bonder |