JPS5313177B2 - - Google Patents

Info

Publication number
JPS5313177B2
JPS5313177B2 JP6873473A JP6873473A JPS5313177B2 JP S5313177 B2 JPS5313177 B2 JP S5313177B2 JP 6873473 A JP6873473 A JP 6873473A JP 6873473 A JP6873473 A JP 6873473A JP S5313177 B2 JPS5313177 B2 JP S5313177B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6873473A
Other languages
Japanese (ja)
Other versions
JPS5017341A (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6873473A priority Critical patent/JPS5313177B2/ja
Priority to US480472A priority patent/US3905883A/en
Publication of JPS5017341A publication Critical patent/JPS5017341A/ja
Publication of JPS5313177B2 publication Critical patent/JPS5313177B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
JP6873473A 1973-06-20 1973-06-20 Expired JPS5313177B2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6873473A JPS5313177B2 (fr) 1973-06-20 1973-06-20
US480472A US3905883A (en) 1973-06-20 1974-06-18 Electrolytic etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6873473A JPS5313177B2 (fr) 1973-06-20 1973-06-20

Publications (2)

Publication Number Publication Date
JPS5017341A JPS5017341A (fr) 1975-02-24
JPS5313177B2 true JPS5313177B2 (fr) 1978-05-08

Family

ID=13382302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6873473A Expired JPS5313177B2 (fr) 1973-06-20 1973-06-20

Country Status (2)

Country Link
US (1) US3905883A (fr)
JP (1) JPS5313177B2 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4543153A (en) * 1984-05-17 1985-09-24 Psi Star Process and apparatus for etching copper masked by a nickel-gold mask
US5102520A (en) * 1990-10-31 1992-04-07 Behr Omri M Electrolytic etching process and apparatus
US5248386A (en) * 1991-02-08 1993-09-28 Aluminum Company Of America Milling solution and method
JP2699028B2 (ja) * 1991-02-22 1998-01-19 大日本スクリーン製造株式会社 面出し方法及び装置
US5509556A (en) * 1994-11-17 1996-04-23 International Business Machines Corporation Process for forming apertures in a metallic sheet
US6891461B2 (en) 1999-11-23 2005-05-10 Intel Corporation Integrated transformer
US6870456B2 (en) 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US6452247B1 (en) * 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6815220B2 (en) * 1999-11-23 2004-11-09 Intel Corporation Magnetic layer processing
US6856228B2 (en) * 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
SE519898C2 (sv) * 2001-09-10 2003-04-22 Obducat Ab Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet
US7852185B2 (en) * 2003-05-05 2010-12-14 Intel Corporation On-die micro-transformer structures with magnetic materials
US8134548B2 (en) 2005-06-30 2012-03-13 Micron Technology, Inc. DC-DC converter switching transistor current measurement technique
JP6296491B2 (ja) * 2013-03-14 2018-03-20 セイコーインスツル株式会社 金属構造体、金属構造体の製造方法、ばね部品、時計用発停レバーおよび時計
JP6417586B2 (ja) 2014-08-25 2018-11-07 セイコーエプソン株式会社 造形方法および造形物
US11738927B2 (en) 2018-06-21 2023-08-29 First Quality Tissue, Llc Bundled product and system and method for forming the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3013956A (en) * 1957-04-05 1961-12-19 Baldwin Piano Co Methods of etching metals in the platinum group and producing printed circuits therefrom
NL6613586A (fr) * 1966-09-27 1968-03-28
US3560357A (en) * 1968-07-26 1971-02-02 Rca Corp Electroetching of a conductive film on an insulating substrate
US3560358A (en) * 1968-09-12 1971-02-02 Motorola Inc Electrolytic etching of platinum for metallization
NL157662B (nl) * 1969-05-22 1978-08-15 Philips Nv Werkwijze voor het etsen van een oppervlak onder toepassing van een etsmasker, alsmede voorwerpen, verkregen door toepassing van deze werkwijze.

Also Published As

Publication number Publication date
US3905883A (en) 1975-09-16
JPS5017341A (fr) 1975-02-24

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