JPS5313177B2 - - Google Patents
Info
- Publication number
- JPS5313177B2 JPS5313177B2 JP6873473A JP6873473A JPS5313177B2 JP S5313177 B2 JPS5313177 B2 JP S5313177B2 JP 6873473 A JP6873473 A JP 6873473A JP 6873473 A JP6873473 A JP 6873473A JP S5313177 B2 JPS5313177 B2 JP S5313177B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6873473A JPS5313177B2 (es) | 1973-06-20 | 1973-06-20 | |
US480472A US3905883A (en) | 1973-06-20 | 1974-06-18 | Electrolytic etching method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6873473A JPS5313177B2 (es) | 1973-06-20 | 1973-06-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5017341A JPS5017341A (es) | 1975-02-24 |
JPS5313177B2 true JPS5313177B2 (es) | 1978-05-08 |
Family
ID=13382302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6873473A Expired JPS5313177B2 (es) | 1973-06-20 | 1973-06-20 |
Country Status (2)
Country | Link |
---|---|
US (1) | US3905883A (es) |
JP (1) | JPS5313177B2 (es) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4543153A (en) * | 1984-05-17 | 1985-09-24 | Psi Star | Process and apparatus for etching copper masked by a nickel-gold mask |
US5102520A (en) * | 1990-10-31 | 1992-04-07 | Behr Omri M | Electrolytic etching process and apparatus |
US5248386A (en) * | 1991-02-08 | 1993-09-28 | Aluminum Company Of America | Milling solution and method |
JP2699028B2 (ja) * | 1991-02-22 | 1998-01-19 | 大日本スクリーン製造株式会社 | 面出し方法及び装置 |
US5509556A (en) * | 1994-11-17 | 1996-04-23 | International Business Machines Corporation | Process for forming apertures in a metallic sheet |
US6870456B2 (en) | 1999-11-23 | 2005-03-22 | Intel Corporation | Integrated transformer |
US6815220B2 (en) * | 1999-11-23 | 2004-11-09 | Intel Corporation | Magnetic layer processing |
US6856228B2 (en) | 1999-11-23 | 2005-02-15 | Intel Corporation | Integrated inductor |
US6452247B1 (en) * | 1999-11-23 | 2002-09-17 | Intel Corporation | Inductor for integrated circuit |
US6891461B2 (en) | 1999-11-23 | 2005-05-10 | Intel Corporation | Integrated transformer |
SE519898C2 (sv) * | 2001-09-10 | 2003-04-22 | Obducat Ab | Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet |
US7852185B2 (en) * | 2003-05-05 | 2010-12-14 | Intel Corporation | On-die micro-transformer structures with magnetic materials |
US8134548B2 (en) | 2005-06-30 | 2012-03-13 | Micron Technology, Inc. | DC-DC converter switching transistor current measurement technique |
JP6296491B2 (ja) * | 2013-03-14 | 2018-03-20 | セイコーインスツル株式会社 | 金属構造体、金属構造体の製造方法、ばね部品、時計用発停レバーおよび時計 |
JP6417586B2 (ja) * | 2014-08-25 | 2018-11-07 | セイコーエプソン株式会社 | 造形方法および造形物 |
US11738927B2 (en) | 2018-06-21 | 2023-08-29 | First Quality Tissue, Llc | Bundled product and system and method for forming the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3013956A (en) * | 1957-04-05 | 1961-12-19 | Baldwin Piano Co | Methods of etching metals in the platinum group and producing printed circuits therefrom |
NL6613586A (es) * | 1966-09-27 | 1968-03-28 | ||
US3560357A (en) * | 1968-07-26 | 1971-02-02 | Rca Corp | Electroetching of a conductive film on an insulating substrate |
US3560358A (en) * | 1968-09-12 | 1971-02-02 | Motorola Inc | Electrolytic etching of platinum for metallization |
NL157662B (nl) * | 1969-05-22 | 1978-08-15 | Philips Nv | Werkwijze voor het etsen van een oppervlak onder toepassing van een etsmasker, alsmede voorwerpen, verkregen door toepassing van deze werkwijze. |
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1973
- 1973-06-20 JP JP6873473A patent/JPS5313177B2/ja not_active Expired
-
1974
- 1974-06-18 US US480472A patent/US3905883A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US3905883A (en) | 1975-09-16 |
JPS5017341A (es) | 1975-02-24 |