JPS53121071A - Manufacture of bases for chemical plating - Google Patents

Manufacture of bases for chemical plating

Info

Publication number
JPS53121071A
JPS53121071A JP3711677A JP3711677A JPS53121071A JP S53121071 A JPS53121071 A JP S53121071A JP 3711677 A JP3711677 A JP 3711677A JP 3711677 A JP3711677 A JP 3711677A JP S53121071 A JPS53121071 A JP S53121071A
Authority
JP
Japan
Prior art keywords
chemical plating
bases
manufacture
resin sheets
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3711677A
Other languages
Japanese (ja)
Inventor
Hideo Kawamura
Toshio Nakanishi
Kunio Iijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP3711677A priority Critical patent/JPS53121071A/en
Publication of JPS53121071A publication Critical patent/JPS53121071A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To manufacture bases for chemical plating having a high peel strength of metal leyers, by forming specific flexible layers on the rough surfaces of synthetic resin sheets for rough surface transfer, by laying phenolic resin prepregs on said layers to press them, and by peeling said resin sheets.
COPYRIGHT: (C)1978,JPO&Japio
JP3711677A 1977-03-31 1977-03-31 Manufacture of bases for chemical plating Pending JPS53121071A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3711677A JPS53121071A (en) 1977-03-31 1977-03-31 Manufacture of bases for chemical plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3711677A JPS53121071A (en) 1977-03-31 1977-03-31 Manufacture of bases for chemical plating

Publications (1)

Publication Number Publication Date
JPS53121071A true JPS53121071A (en) 1978-10-23

Family

ID=12488618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3711677A Pending JPS53121071A (en) 1977-03-31 1977-03-31 Manufacture of bases for chemical plating

Country Status (1)

Country Link
JP (1) JPS53121071A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008195950A (en) * 2008-03-17 2008-08-28 Ibiden Co Ltd Adhesive for printed wiring board and adhesive layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008195950A (en) * 2008-03-17 2008-08-28 Ibiden Co Ltd Adhesive for printed wiring board and adhesive layer

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