JPS53121071A - Manufacture of bases for chemical plating - Google Patents
Manufacture of bases for chemical platingInfo
- Publication number
- JPS53121071A JPS53121071A JP3711677A JP3711677A JPS53121071A JP S53121071 A JPS53121071 A JP S53121071A JP 3711677 A JP3711677 A JP 3711677A JP 3711677 A JP3711677 A JP 3711677A JP S53121071 A JPS53121071 A JP S53121071A
- Authority
- JP
- Japan
- Prior art keywords
- chemical plating
- bases
- manufacture
- resin sheets
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To manufacture bases for chemical plating having a high peel strength of metal leyers, by forming specific flexible layers on the rough surfaces of synthetic resin sheets for rough surface transfer, by laying phenolic resin prepregs on said layers to press them, and by peeling said resin sheets.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3711677A JPS53121071A (en) | 1977-03-31 | 1977-03-31 | Manufacture of bases for chemical plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3711677A JPS53121071A (en) | 1977-03-31 | 1977-03-31 | Manufacture of bases for chemical plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53121071A true JPS53121071A (en) | 1978-10-23 |
Family
ID=12488618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3711677A Pending JPS53121071A (en) | 1977-03-31 | 1977-03-31 | Manufacture of bases for chemical plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53121071A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008195950A (en) * | 2008-03-17 | 2008-08-28 | Ibiden Co Ltd | Adhesive for printed wiring board and adhesive layer |
-
1977
- 1977-03-31 JP JP3711677A patent/JPS53121071A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008195950A (en) * | 2008-03-17 | 2008-08-28 | Ibiden Co Ltd | Adhesive for printed wiring board and adhesive layer |
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