JPS5252981A - Process for producing bases for chemical plating - Google Patents

Process for producing bases for chemical plating

Info

Publication number
JPS5252981A
JPS5252981A JP12871575A JP12871575A JPS5252981A JP S5252981 A JPS5252981 A JP S5252981A JP 12871575 A JP12871575 A JP 12871575A JP 12871575 A JP12871575 A JP 12871575A JP S5252981 A JPS5252981 A JP S5252981A
Authority
JP
Japan
Prior art keywords
chemical plating
bases
producing bases
plating
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12871575A
Other languages
Japanese (ja)
Other versions
JPS5922669B2 (en
Inventor
Kunio Iijima
Toshio Nakanishi
Hideo Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP12871575A priority Critical patent/JPS5922669B2/en
Publication of JPS5252981A publication Critical patent/JPS5252981A/en
Publication of JPS5922669B2 publication Critical patent/JPS5922669B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Abstract

PURPOSE: A process for prodicing bases for chemical plating with improved stability and adhesiveness of plating, and small dimensional change, warpage and twist, by the laminating molding with setting up the specific prepregs as surface layers and inner layers.
COPYRIGHT: (C)1977,JPO&Japio
JP12871575A 1975-10-24 1975-10-24 Kagakumetsukiyoukibannoseihou Expired JPS5922669B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12871575A JPS5922669B2 (en) 1975-10-24 1975-10-24 Kagakumetsukiyoukibannoseihou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12871575A JPS5922669B2 (en) 1975-10-24 1975-10-24 Kagakumetsukiyoukibannoseihou

Publications (2)

Publication Number Publication Date
JPS5252981A true JPS5252981A (en) 1977-04-28
JPS5922669B2 JPS5922669B2 (en) 1984-05-28

Family

ID=14991624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12871575A Expired JPS5922669B2 (en) 1975-10-24 1975-10-24 Kagakumetsukiyoukibannoseihou

Country Status (1)

Country Link
JP (1) JPS5922669B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58136330U (en) * 1982-03-08 1983-09-13 東洋テルミ−株式会社 Plastic plated products
JPS60136295A (en) * 1983-12-23 1985-07-19 セイコーエプソン株式会社 Additive multilayer printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58136330U (en) * 1982-03-08 1983-09-13 東洋テルミ−株式会社 Plastic plated products
JPS60136295A (en) * 1983-12-23 1985-07-19 セイコーエプソン株式会社 Additive multilayer printed circuit board

Also Published As

Publication number Publication date
JPS5922669B2 (en) 1984-05-28

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