JPS5311836B2 - - Google Patents
Info
- Publication number
- JPS5311836B2 JPS5311836B2 JP9734475A JP9734475A JPS5311836B2 JP S5311836 B2 JPS5311836 B2 JP S5311836B2 JP 9734475 A JP9734475 A JP 9734475A JP 9734475 A JP9734475 A JP 9734475A JP S5311836 B2 JPS5311836 B2 JP S5311836B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9734475A JPS5220783A (en) | 1975-08-11 | 1975-08-11 | Semi-conductor unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9734475A JPS5220783A (en) | 1975-08-11 | 1975-08-11 | Semi-conductor unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5220783A JPS5220783A (en) | 1977-02-16 |
| JPS5311836B2 true JPS5311836B2 (enrdf_load_stackoverflow) | 1978-04-25 |
Family
ID=14189850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9734475A Granted JPS5220783A (en) | 1975-08-11 | 1975-08-11 | Semi-conductor unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5220783A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5422186A (en) * | 1977-07-20 | 1979-02-19 | Matsushita Electric Ind Co Ltd | Light emitting diode device |
| JP6116413B2 (ja) * | 2013-07-09 | 2017-04-19 | 三菱電機株式会社 | 電力用半導体装置の製造方法 |
| JP2015174129A (ja) * | 2014-03-17 | 2015-10-05 | 株式会社日本スペリア社 | 液状金属接合材並びにその接合方法 |
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1975
- 1975-08-11 JP JP9734475A patent/JPS5220783A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5220783A (en) | 1977-02-16 |