Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP50104016ApriorityCriticalpatent/JPS5228869A/ja
Publication of JPS5228869ApublicationCriticalpatent/JPS5228869A/ja
Publication of JPS5311826B2publicationCriticalpatent/JPS5311826B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
H01L2224/4805—Shape
H01L2224/4809—Loop shape
H01L2224/48091—Arched
Landscapes
Moulds For Moulding Plastics Or The Like
(AREA)
Injection Moulding Of Plastics Or The Like
(AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices
(AREA)
Cooling Or The Like Of Electrical Apparatus
(AREA)
Lead Frames For Integrated Circuits
(AREA)
JP50104016A1975-08-291975-08-29Process for molding and the mold and heat-radiation header for the pro cess
GrantedJPS5228869A
(en)