JPS53114067A - Electronic part device and method of producing same - Google Patents

Electronic part device and method of producing same

Info

Publication number
JPS53114067A
JPS53114067A JP2761077A JP2761077A JPS53114067A JP S53114067 A JPS53114067 A JP S53114067A JP 2761077 A JP2761077 A JP 2761077A JP 2761077 A JP2761077 A JP 2761077A JP S53114067 A JPS53114067 A JP S53114067A
Authority
JP
Japan
Prior art keywords
electronic part
producing same
part device
producing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2761077A
Other languages
Japanese (ja)
Inventor
Tooru Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP2761077A priority Critical patent/JPS53114067A/en
Publication of JPS53114067A publication Critical patent/JPS53114067A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2761077A 1977-03-15 1977-03-15 Electronic part device and method of producing same Pending JPS53114067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2761077A JPS53114067A (en) 1977-03-15 1977-03-15 Electronic part device and method of producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2761077A JPS53114067A (en) 1977-03-15 1977-03-15 Electronic part device and method of producing same

Publications (1)

Publication Number Publication Date
JPS53114067A true JPS53114067A (en) 1978-10-05

Family

ID=12225688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2761077A Pending JPS53114067A (en) 1977-03-15 1977-03-15 Electronic part device and method of producing same

Country Status (1)

Country Link
JP (1) JPS53114067A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058068A2 (en) * 1981-02-09 1982-08-18 BRITISH TELECOMMUNICATIONS public limited company Integrated circuit chip carrier
JPS58124960U (en) * 1982-02-17 1983-08-25 三洋電機株式会社 Sealing structure of hybrid integrated circuit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058068A2 (en) * 1981-02-09 1982-08-18 BRITISH TELECOMMUNICATIONS public limited company Integrated circuit chip carrier
US4595096A (en) * 1981-02-09 1986-06-17 British Telecommunications Integrated circuit chip carrier
EP0058068B1 (en) * 1981-02-09 1990-10-31 BRITISH TELECOMMUNICATIONS public limited company Integrated circuit chip carrier
JPS58124960U (en) * 1982-02-17 1983-08-25 三洋電機株式会社 Sealing structure of hybrid integrated circuit

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