Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Hitachi Ltd
Original Assignee
Hitachi Ltd
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Filing date
Publication date
Application filed by Hitachi LtdfiledCriticalHitachi Ltd
Priority to JP2596477ApriorityCriticalpatent/JPS53112062A/en
Publication of JPS53112062ApublicationCriticalpatent/JPS53112062A/en
PURPOSE: To perform sealing of high air-tightness with good productivity by providing a thermoplastic, heat-softening or hot melt adhesive layer along the inside circumference of a cap fitting to a stem portion, fitting the stem and cap at ordinary temperature thereafter heating these to allow the adhesive to enter the spacing between the stem and cap.
COPYRIGHT: (C)1978,JPO&Japio
JP2596477A1977-03-111977-03-11Sealing method of semiconductor device
PendingJPS53112062A
(en)