JPS53108286A - Etching control device - Google Patents
Etching control deviceInfo
- Publication number
- JPS53108286A JPS53108286A JP2348977A JP2348977A JPS53108286A JP S53108286 A JPS53108286 A JP S53108286A JP 2348977 A JP2348977 A JP 2348977A JP 2348977 A JP2348977 A JP 2348977A JP S53108286 A JPS53108286 A JP S53108286A
- Authority
- JP
- Japan
- Prior art keywords
- control device
- etching control
- etching
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title 1
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2348977A JPS53108286A (en) | 1977-03-03 | 1977-03-03 | Etching control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2348977A JPS53108286A (en) | 1977-03-03 | 1977-03-03 | Etching control device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53108286A true JPS53108286A (en) | 1978-09-20 |
| JPS6211492B2 JPS6211492B2 (enExample) | 1987-03-12 |
Family
ID=12111915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2348977A Granted JPS53108286A (en) | 1977-03-03 | 1977-03-03 | Etching control device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53108286A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5723226A (en) * | 1980-07-17 | 1982-02-06 | Nippon Telegr & Teleph Corp <Ntt> | Plasma etching device |
| JPS5759332A (en) * | 1980-09-27 | 1982-04-09 | Fujitsu Ltd | Method for detecting finishing time of dry etching reaction |
| JPS57154147U (enExample) * | 1981-03-20 | 1982-09-28 | ||
| JPS5879722A (ja) * | 1981-11-06 | 1983-05-13 | Fujitsu Ltd | プラズマエツチングの制御方法 |
| JPS58215030A (ja) * | 1982-06-08 | 1983-12-14 | Kokusai Electric Co Ltd | 半導体基板のドライエツチング終了時点検出装置 |
| WO2018155425A1 (ja) * | 2017-02-21 | 2018-08-30 | 株式会社アルバック | 素子構造体の製造方法 |
-
1977
- 1977-03-03 JP JP2348977A patent/JPS53108286A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5723226A (en) * | 1980-07-17 | 1982-02-06 | Nippon Telegr & Teleph Corp <Ntt> | Plasma etching device |
| JPS5759332A (en) * | 1980-09-27 | 1982-04-09 | Fujitsu Ltd | Method for detecting finishing time of dry etching reaction |
| JPS57154147U (enExample) * | 1981-03-20 | 1982-09-28 | ||
| JPS5879722A (ja) * | 1981-11-06 | 1983-05-13 | Fujitsu Ltd | プラズマエツチングの制御方法 |
| JPS58215030A (ja) * | 1982-06-08 | 1983-12-14 | Kokusai Electric Co Ltd | 半導体基板のドライエツチング終了時点検出装置 |
| WO2018155425A1 (ja) * | 2017-02-21 | 2018-08-30 | 株式会社アルバック | 素子構造体の製造方法 |
| CN109892012A (zh) * | 2017-02-21 | 2019-06-14 | 株式会社爱发科 | 元件结构体的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211492B2 (enExample) | 1987-03-12 |
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