JPS53106391A - Fill-forming apparatus - Google Patents

Fill-forming apparatus

Info

Publication number
JPS53106391A
JPS53106391A JP2124577A JP2124577A JPS53106391A JP S53106391 A JPS53106391 A JP S53106391A JP 2124577 A JP2124577 A JP 2124577A JP 2124577 A JP2124577 A JP 2124577A JP S53106391 A JPS53106391 A JP S53106391A
Authority
JP
Japan
Prior art keywords
fill
film
forming apparatus
vacuum
chambers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2124577A
Other languages
Japanese (ja)
Inventor
Takao Furuse
Toru Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2124577A priority Critical patent/JPS53106391A/en
Publication of JPS53106391A publication Critical patent/JPS53106391A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228Gas flow assisted PVD deposition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To make it possible to produce a film of excellent quality having no defect caused by ionic impact, by dividing a vacuum vessel into two chambers with a partition wall having a small opening, by leading sputtered material formed in a discharge chamber by the difference in degree of vacuum to the other film-forming chamber in which is arranged a substrate alone.
JP2124577A 1977-02-28 1977-02-28 Fill-forming apparatus Pending JPS53106391A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2124577A JPS53106391A (en) 1977-02-28 1977-02-28 Fill-forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2124577A JPS53106391A (en) 1977-02-28 1977-02-28 Fill-forming apparatus

Publications (1)

Publication Number Publication Date
JPS53106391A true JPS53106391A (en) 1978-09-16

Family

ID=12049663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2124577A Pending JPS53106391A (en) 1977-02-28 1977-02-28 Fill-forming apparatus

Country Status (1)

Country Link
JP (1) JPS53106391A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0141417A2 (en) * 1983-11-07 1985-05-15 Hitachi, Ltd. Apparatus for forming film by ion beam
EP0166991A2 (en) * 1984-06-04 1986-01-08 Nisshin Steel Co., Ltd. Method of controlling deposition amount distribution in a vacuum deposition plating
WO1996024703A1 (en) * 1995-02-10 1996-08-15 Jet Process Corporation An electron jet vapor deposition system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0141417A2 (en) * 1983-11-07 1985-05-15 Hitachi, Ltd. Apparatus for forming film by ion beam
EP0166991A2 (en) * 1984-06-04 1986-01-08 Nisshin Steel Co., Ltd. Method of controlling deposition amount distribution in a vacuum deposition plating
WO1996024703A1 (en) * 1995-02-10 1996-08-15 Jet Process Corporation An electron jet vapor deposition system

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