JPS53105972A - Method of presssbonding tape bonder without solder - Google Patents

Method of presssbonding tape bonder without solder

Info

Publication number
JPS53105972A
JPS53105972A JP2110577A JP2110577A JPS53105972A JP S53105972 A JPS53105972 A JP S53105972A JP 2110577 A JP2110577 A JP 2110577A JP 2110577 A JP2110577 A JP 2110577A JP S53105972 A JPS53105972 A JP S53105972A
Authority
JP
Japan
Prior art keywords
presssbonding
solder
tape bonder
bonder
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2110577A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5751937B2 (enrdf_load_stackoverflow
Inventor
Kazuo Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP2110577A priority Critical patent/JPS53105972A/ja
Publication of JPS53105972A publication Critical patent/JPS53105972A/ja
Publication of JPS5751937B2 publication Critical patent/JPS5751937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP2110577A 1977-02-28 1977-02-28 Method of presssbonding tape bonder without solder Granted JPS53105972A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2110577A JPS53105972A (en) 1977-02-28 1977-02-28 Method of presssbonding tape bonder without solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2110577A JPS53105972A (en) 1977-02-28 1977-02-28 Method of presssbonding tape bonder without solder

Publications (2)

Publication Number Publication Date
JPS53105972A true JPS53105972A (en) 1978-09-14
JPS5751937B2 JPS5751937B2 (enrdf_load_stackoverflow) 1982-11-05

Family

ID=12045584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2110577A Granted JPS53105972A (en) 1977-02-28 1977-02-28 Method of presssbonding tape bonder without solder

Country Status (1)

Country Link
JP (1) JPS53105972A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455028U (enrdf_load_stackoverflow) * 1990-09-17 1992-05-12

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143075A (en) * 1974-09-30 1976-04-13 Jeido Corp Za Handotaisochi mataha ruijibutsuniriidoo seikakunisetsugosurusochi

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143075A (en) * 1974-09-30 1976-04-13 Jeido Corp Za Handotaisochi mataha ruijibutsuniriidoo seikakunisetsugosurusochi

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法

Also Published As

Publication number Publication date
JPS5751937B2 (enrdf_load_stackoverflow) 1982-11-05

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