JPS5751937B2 - - Google Patents

Info

Publication number
JPS5751937B2
JPS5751937B2 JP52021105A JP2110577A JPS5751937B2 JP S5751937 B2 JPS5751937 B2 JP S5751937B2 JP 52021105 A JP52021105 A JP 52021105A JP 2110577 A JP2110577 A JP 2110577A JP S5751937 B2 JPS5751937 B2 JP S5751937B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52021105A
Other languages
Japanese (ja)
Other versions
JPS53105972A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2110577A priority Critical patent/JPS53105972A/ja
Publication of JPS53105972A publication Critical patent/JPS53105972A/ja
Publication of JPS5751937B2 publication Critical patent/JPS5751937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP2110577A 1977-02-28 1977-02-28 Method of presssbonding tape bonder without solder Granted JPS53105972A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2110577A JPS53105972A (en) 1977-02-28 1977-02-28 Method of presssbonding tape bonder without solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2110577A JPS53105972A (en) 1977-02-28 1977-02-28 Method of presssbonding tape bonder without solder

Publications (2)

Publication Number Publication Date
JPS53105972A JPS53105972A (en) 1978-09-14
JPS5751937B2 true JPS5751937B2 (enrdf_load_stackoverflow) 1982-11-05

Family

ID=12045584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2110577A Granted JPS53105972A (en) 1977-02-28 1977-02-28 Method of presssbonding tape bonder without solder

Country Status (1)

Country Link
JP (1) JPS53105972A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455028U (enrdf_load_stackoverflow) * 1990-09-17 1992-05-12

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4010885A (en) * 1974-09-30 1977-03-08 The Jade Corporation Apparatus for accurately bonding leads to a semi-conductor die or the like

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455028U (enrdf_load_stackoverflow) * 1990-09-17 1992-05-12

Also Published As

Publication number Publication date
JPS53105972A (en) 1978-09-14

Similar Documents

Publication Publication Date Title
FR2377623B1 (enrdf_load_stackoverflow)
FR2378397B1 (enrdf_load_stackoverflow)
DK345278A (enrdf_load_stackoverflow)
FR2379099B1 (enrdf_load_stackoverflow)
FR2376548B1 (enrdf_load_stackoverflow)
FR2376810B1 (enrdf_load_stackoverflow)
FR2376561B1 (enrdf_load_stackoverflow)
FR2347682B1 (enrdf_load_stackoverflow)
FR2377567B1 (enrdf_load_stackoverflow)
FR2367643B1 (enrdf_load_stackoverflow)
FR2377714B1 (enrdf_load_stackoverflow)
FR2377698B1 (enrdf_load_stackoverflow)
FR2377291B2 (enrdf_load_stackoverflow)
JPS5753972B2 (enrdf_load_stackoverflow)
JPS5753974B2 (enrdf_load_stackoverflow)
JPS5753973B2 (enrdf_load_stackoverflow)
DK204177A (enrdf_load_stackoverflow)
DK141070C (enrdf_load_stackoverflow)
DE2718112C2 (enrdf_load_stackoverflow)
BG25852A1 (enrdf_load_stackoverflow)
BG25837A1 (enrdf_load_stackoverflow)
BG25860A1 (enrdf_load_stackoverflow)
BG25855A1 (enrdf_load_stackoverflow)
BG25853A1 (enrdf_load_stackoverflow)
BG25839A1 (enrdf_load_stackoverflow)