JPS5286159A - Electric circuit unit - Google Patents

Electric circuit unit

Info

Publication number
JPS5286159A
JPS5286159A JP227877A JP227877A JPS5286159A JP S5286159 A JPS5286159 A JP S5286159A JP 227877 A JP227877 A JP 227877A JP 227877 A JP227877 A JP 227877A JP S5286159 A JPS5286159 A JP S5286159A
Authority
JP
Japan
Prior art keywords
circuit unit
electric circuit
electric
unit
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP227877A
Other languages
English (en)
Japanese (ja)
Inventor
Ganzeruto Buirii
Tsuitsuperaa Marutein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPS5286159A publication Critical patent/JPS5286159A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP227877A 1976-01-13 1977-01-12 Electric circuit unit Pending JPS5286159A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762601035 DE2601035A1 (de) 1976-01-13 1976-01-13 Elektrische schaltungsanordnung

Publications (1)

Publication Number Publication Date
JPS5286159A true JPS5286159A (en) 1977-07-18

Family

ID=5967365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP227877A Pending JPS5286159A (en) 1976-01-13 1977-01-12 Electric circuit unit

Country Status (9)

Country Link
US (1) US4103321A (OSRAM)
JP (1) JPS5286159A (OSRAM)
BE (1) BE850307A (OSRAM)
DE (1) DE2601035A1 (OSRAM)
FR (1) FR2338621A1 (OSRAM)
GB (1) GB1519751A (OSRAM)
IT (1) IT1080307B (OSRAM)
NL (1) NL7700260A (OSRAM)
SE (1) SE7700253L (OSRAM)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1130466A (en) * 1979-01-31 1982-08-24 William D. Jordan Heat sink mounting
US4258411A (en) * 1979-05-21 1981-03-24 Bell Telephone Laboratories, Incorporated Electronic device packaging arrangement
US4288839A (en) * 1979-10-18 1981-09-08 Gould Inc. Solid state device mounting and heat dissipating assembly
US4321423A (en) * 1980-05-15 1982-03-23 Aavid Engineering, Inc. Heat sink fastenings
DE3305167C2 (de) * 1983-02-15 1994-05-05 Bosch Gmbh Robert Elektrische Schaltungsanordnung mit einer Leiterplatte
GB2157077B (en) * 1984-04-05 1987-10-21 Burr Brown Corp Heat sinks for minimizing noise in precision electronic components
US4953060A (en) * 1989-05-05 1990-08-28 Ncr Corporation Stackable integrated circuit chip package with improved heat removal
US5322812A (en) * 1991-03-20 1994-06-21 Crosspoint Solutions, Inc. Improved method of fabricating antifuses in an integrated circuit device and resulting structure
KR940704114A (ko) * 1991-12-18 1994-12-12 마이클 레비스 필드 프로그래머블 게이트 어레이용 확장 구조(extended architecture for field programmable gate array)
US5850104A (en) * 1997-01-06 1998-12-15 Spectrian, Inc. Integral lid/clamp for high power transistor
US6195257B1 (en) * 1999-02-13 2001-02-27 Lucent Technologies Inc. Apparatus and method of adapting a rectifier module to enhance cooling
US20040124507A1 (en) * 2002-12-30 2004-07-01 Aldaz Robert Edward Contact structure and production method thereof
CN100454595C (zh) * 2005-12-09 2009-01-21 富准精密工业(深圳)有限公司 发光二极管模组
TWI340441B (en) * 2007-07-20 2011-04-11 Kuanchun Chen Semiconductor device and method for manufacturing the same
JP5479139B2 (ja) * 2010-02-10 2014-04-23 三菱重工業株式会社 インバータ一体型電動圧縮機およびその組立方法
WO2014072889A1 (en) * 2012-11-07 2014-05-15 Koninklijke Philips N.V. Arrangement of components for a lighting device
CN103957661B (zh) * 2014-05-21 2017-01-11 北京控制工程研究所 一种局部消除厚度方向热失配的印制电路板结构
DE102017223619B3 (de) * 2017-12-21 2019-05-09 Robert Bosch Gmbh Steuergerät für eine elektrische Maschine
US11849536B1 (en) 2022-10-12 2023-12-19 Lunar Energy, Inc. Gantry for thermal management
WO2024081005A1 (en) * 2022-10-12 2024-04-18 Lunar Energy, Inc. Gantry for thermal management
US11889662B1 (en) 2022-10-12 2024-01-30 Lunar Energy, Inc. Thermal interface sandwich
US11997812B2 (en) 2022-10-12 2024-05-28 Lunar Energy, Inc. Cover for sealing a power module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465212A (en) * 1966-03-10 1969-09-02 Rca Corp Heat dissipator
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum

Also Published As

Publication number Publication date
IT1080307B (it) 1985-05-16
NL7700260A (nl) 1977-07-15
FR2338621A1 (fr) 1977-08-12
FR2338621B1 (OSRAM) 1980-06-27
DE2601035A1 (de) 1977-07-21
SE7700253L (sv) 1977-07-14
GB1519751A (en) 1978-08-02
US4103321A (en) 1978-07-25
BE850307A (fr) 1977-05-02

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