FR2338621A1 - Dispositif de connexion electrique - Google Patents

Dispositif de connexion electrique

Info

Publication number
FR2338621A1
FR2338621A1 FR7638542A FR7638542A FR2338621A1 FR 2338621 A1 FR2338621 A1 FR 2338621A1 FR 7638542 A FR7638542 A FR 7638542A FR 7638542 A FR7638542 A FR 7638542A FR 2338621 A1 FR2338621 A1 FR 2338621A1
Authority
FR
France
Prior art keywords
electrical connection
connection device
electrical
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7638542A
Other languages
English (en)
Other versions
FR2338621B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2338621A1 publication Critical patent/FR2338621A1/fr
Application granted granted Critical
Publication of FR2338621B1 publication Critical patent/FR2338621B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
FR7638542A 1976-01-13 1976-12-21 Dispositif de connexion electrique Granted FR2338621A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762601035 DE2601035A1 (de) 1976-01-13 1976-01-13 Elektrische schaltungsanordnung

Publications (2)

Publication Number Publication Date
FR2338621A1 true FR2338621A1 (fr) 1977-08-12
FR2338621B1 FR2338621B1 (fr) 1980-06-27

Family

ID=5967365

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7638542A Granted FR2338621A1 (fr) 1976-01-13 1976-12-21 Dispositif de connexion electrique

Country Status (9)

Country Link
US (1) US4103321A (fr)
JP (1) JPS5286159A (fr)
BE (1) BE850307A (fr)
DE (1) DE2601035A1 (fr)
FR (1) FR2338621A1 (fr)
GB (1) GB1519751A (fr)
IT (1) IT1080307B (fr)
NL (1) NL7700260A (fr)
SE (1) SE7700253L (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0014558A1 (fr) * 1979-01-31 1980-08-20 Thermalloy Incorporated Assemblage d'un composant électrique et d'un refroidisseur sur un support à circuit imprimé et procédé pour l'assemblage

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4258411A (en) * 1979-05-21 1981-03-24 Bell Telephone Laboratories, Incorporated Electronic device packaging arrangement
US4288839A (en) * 1979-10-18 1981-09-08 Gould Inc. Solid state device mounting and heat dissipating assembly
US4321423A (en) * 1980-05-15 1982-03-23 Aavid Engineering, Inc. Heat sink fastenings
DE3305167C2 (de) * 1983-02-15 1994-05-05 Bosch Gmbh Robert Elektrische Schaltungsanordnung mit einer Leiterplatte
GB2157077B (en) * 1984-04-05 1987-10-21 Burr Brown Corp Heat sinks for minimizing noise in precision electronic components
US4953060A (en) * 1989-05-05 1990-08-28 Ncr Corporation Stackable integrated circuit chip package with improved heat removal
US5322812A (en) * 1991-03-20 1994-06-21 Crosspoint Solutions, Inc. Improved method of fabricating antifuses in an integrated circuit device and resulting structure
JPH07502377A (ja) * 1991-12-18 1995-03-09 クロスポイント・ソルーションズ・インコーポレイテッド フィールドプログラマブルゲートアレイのための拡張アーキテクチャ
US5850104A (en) * 1997-01-06 1998-12-15 Spectrian, Inc. Integral lid/clamp for high power transistor
US6195257B1 (en) * 1999-02-13 2001-02-27 Lucent Technologies Inc. Apparatus and method of adapting a rectifier module to enhance cooling
US20040124507A1 (en) * 2002-12-30 2004-07-01 Aldaz Robert Edward Contact structure and production method thereof
CN100454595C (zh) * 2005-12-09 2009-01-21 富准精密工业(深圳)有限公司 发光二极管模组
TWI340441B (en) * 2007-07-20 2011-04-11 Kuanchun Chen Semiconductor device and method for manufacturing the same
JP5479139B2 (ja) * 2010-02-10 2014-04-23 三菱重工業株式会社 インバータ一体型電動圧縮機およびその組立方法
WO2014072889A1 (fr) * 2012-11-07 2014-05-15 Koninklijke Philips N.V. Agencement d'éléments pour un dispositif d'éclairage
CN103957661B (zh) * 2014-05-21 2017-01-11 北京控制工程研究所 一种局部消除厚度方向热失配的印制电路板结构
DE102017223619B3 (de) * 2017-12-21 2019-05-09 Robert Bosch Gmbh Steuergerät für eine elektrische Maschine
US11849536B1 (en) 2022-10-12 2023-12-19 Lunar Energy, Inc. Gantry for thermal management
US11889662B1 (en) 2022-10-12 2024-01-30 Lunar Energy, Inc. Thermal interface sandwich

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465212A (en) * 1966-03-10 1969-09-02 Rca Corp Heat dissipator

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465212A (en) * 1966-03-10 1969-09-02 Rca Corp Heat dissipator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0014558A1 (fr) * 1979-01-31 1980-08-20 Thermalloy Incorporated Assemblage d'un composant électrique et d'un refroidisseur sur un support à circuit imprimé et procédé pour l'assemblage

Also Published As

Publication number Publication date
NL7700260A (nl) 1977-07-15
FR2338621B1 (fr) 1980-06-27
GB1519751A (en) 1978-08-02
DE2601035A1 (de) 1977-07-21
US4103321A (en) 1978-07-25
BE850307A (fr) 1977-05-02
IT1080307B (it) 1985-05-16
SE7700253L (sv) 1977-07-14
JPS5286159A (en) 1977-07-18

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Legal Events

Date Code Title Description
ST Notification of lapse