JPS5275639A - Brazing method and device thereof - Google Patents

Brazing method and device thereof

Info

Publication number
JPS5275639A
JPS5275639A JP15266575A JP15266575A JPS5275639A JP S5275639 A JPS5275639 A JP S5275639A JP 15266575 A JP15266575 A JP 15266575A JP 15266575 A JP15266575 A JP 15266575A JP S5275639 A JPS5275639 A JP S5275639A
Authority
JP
Japan
Prior art keywords
brazing method
brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15266575A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5513831B2 (enrdf_load_stackoverflow
Inventor
Tsukasa Sawaki
Kenji Mitsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP15266575A priority Critical patent/JPS5275639A/ja
Publication of JPS5275639A publication Critical patent/JPS5275639A/ja
Publication of JPS5513831B2 publication Critical patent/JPS5513831B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP15266575A 1975-12-19 1975-12-19 Brazing method and device thereof Granted JPS5275639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15266575A JPS5275639A (en) 1975-12-19 1975-12-19 Brazing method and device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15266575A JPS5275639A (en) 1975-12-19 1975-12-19 Brazing method and device thereof

Publications (2)

Publication Number Publication Date
JPS5275639A true JPS5275639A (en) 1977-06-24
JPS5513831B2 JPS5513831B2 (enrdf_load_stackoverflow) 1980-04-11

Family

ID=15545400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15266575A Granted JPS5275639A (en) 1975-12-19 1975-12-19 Brazing method and device thereof

Country Status (1)

Country Link
JP (1) JPS5275639A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5482168A (en) * 1977-12-14 1979-06-30 Fujitsu Ltd Diboinding method for semiconductor chip

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142801A (ja) * 1983-12-29 1985-07-29 元田　安弘 はきものの足固定用すべり止め
JPH03127501U (enrdf_load_stackoverflow) * 1990-04-02 1991-12-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5482168A (en) * 1977-12-14 1979-06-30 Fujitsu Ltd Diboinding method for semiconductor chip

Also Published As

Publication number Publication date
JPS5513831B2 (enrdf_load_stackoverflow) 1980-04-11

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