JPS5275639A - Brazing method and device thereof - Google Patents
Brazing method and device thereofInfo
- Publication number
- JPS5275639A JPS5275639A JP15266575A JP15266575A JPS5275639A JP S5275639 A JPS5275639 A JP S5275639A JP 15266575 A JP15266575 A JP 15266575A JP 15266575 A JP15266575 A JP 15266575A JP S5275639 A JPS5275639 A JP S5275639A
- Authority
- JP
- Japan
- Prior art keywords
- brazing method
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15266575A JPS5275639A (en) | 1975-12-19 | 1975-12-19 | Brazing method and device thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15266575A JPS5275639A (en) | 1975-12-19 | 1975-12-19 | Brazing method and device thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5275639A true JPS5275639A (en) | 1977-06-24 |
JPS5513831B2 JPS5513831B2 (en) | 1980-04-11 |
Family
ID=15545400
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15266575A Granted JPS5275639A (en) | 1975-12-19 | 1975-12-19 | Brazing method and device thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5275639A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5482168A (en) * | 1977-12-14 | 1979-06-30 | Fujitsu Ltd | Diboinding method for semiconductor chip |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60142801A (en) * | 1983-12-29 | 1985-07-29 | 元田 安弘 | Foot fixing anti-slip body of footwear |
JPH03127501U (en) * | 1990-04-02 | 1991-12-24 |
-
1975
- 1975-12-19 JP JP15266575A patent/JPS5275639A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5482168A (en) * | 1977-12-14 | 1979-06-30 | Fujitsu Ltd | Diboinding method for semiconductor chip |
Also Published As
Publication number | Publication date |
---|---|
JPS5513831B2 (en) | 1980-04-11 |
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