JPS525840B1 - - Google Patents
Info
- Publication number
- JPS525840B1 JPS525840B1 JP5148470A JP5148470A JPS525840B1 JP S525840 B1 JPS525840 B1 JP S525840B1 JP 5148470 A JP5148470 A JP 5148470A JP 5148470 A JP5148470 A JP 5148470A JP S525840 B1 JPS525840 B1 JP S525840B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42C—AMMUNITION FUZES; ARMING OR SAFETY MEANS THEREFOR
- F42C7/00—Fuzes actuated by application of a predetermined mechanical force, e.g. tension, torsion, pressure
- F42C7/12—Percussion fuzes of the double-action type, i.e. fuzes cocked and fired in a single movement, e.g. by pulling an incorporated percussion pin or hammer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3010669 | 1969-06-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS525840B1 true JPS525840B1 (ja) | 1977-02-16 |
Family
ID=10302379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5148470A Pending JPS525840B1 (ja) | 1969-06-13 | 1970-06-13 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS525840B1 (ja) |
DE (1) | DE2028092C3 (ja) |
FR (1) | FR2052566A5 (ja) |
GB (1) | GB1302034A (ja) |
HK (1) | HK10077A (ja) |
SE (1) | SE354114B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021079745A1 (ja) | 2019-10-24 | 2021-04-29 | 信越半導体株式会社 | 半導体基板の製造方法及び半導体基板 |
-
1969
- 1969-06-13 GB GB1302034D patent/GB1302034A/en not_active Expired
-
1970
- 1970-06-08 DE DE19702028092 patent/DE2028092C3/de not_active Expired
- 1970-06-12 SE SE817370A patent/SE354114B/xx unknown
- 1970-06-13 JP JP5148470A patent/JPS525840B1/ja active Pending
- 1970-06-15 FR FR7021861A patent/FR2052566A5/fr not_active Expired
-
1977
- 1977-02-24 HK HK10077A patent/HK10077A/xx unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021079745A1 (ja) | 2019-10-24 | 2021-04-29 | 信越半導体株式会社 | 半導体基板の製造方法及び半導体基板 |
KR20220090506A (ko) | 2019-10-24 | 2022-06-29 | 신에쯔 한도타이 가부시키가이샤 | 반도체기판의 제조방법 및 반도체기판 |
Also Published As
Publication number | Publication date |
---|---|
HK10077A (en) | 1977-03-04 |
DE2028092B2 (de) | 1977-09-08 |
GB1302034A (ja) | 1973-01-04 |
DE2028092A1 (de) | 1970-12-23 |
FR2052566A5 (ja) | 1971-04-09 |
SE354114B (ja) | 1973-02-26 |
DE2028092C3 (de) | 1978-04-20 |