JPS5256034A - Mechanical and chemical etching method and apparatus therefor - Google Patents

Mechanical and chemical etching method and apparatus therefor

Info

Publication number
JPS5256034A
JPS5256034A JP51116683A JP11668376A JPS5256034A JP S5256034 A JPS5256034 A JP S5256034A JP 51116683 A JP51116683 A JP 51116683A JP 11668376 A JP11668376 A JP 11668376A JP S5256034 A JPS5256034 A JP S5256034A
Authority
JP
Japan
Prior art keywords
mechanical
etching method
chemical etching
apparatus therefor
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51116683A
Other languages
English (en)
Inventor
Sare Ibon
Rejie Pieeru
Andore Dabi Jieraaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS5256034A publication Critical patent/JPS5256034A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Photovoltaic Devices (AREA)
JP51116683A 1975-10-03 1976-09-30 Mechanical and chemical etching method and apparatus therefor Pending JPS5256034A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7530332A FR2326479A1 (fr) 1975-10-03 1975-10-03 Procede de decapage de plaquettes semi-conductrices, notamment pour cellules solaires et appareillage de mise en oeuvre du procede

Publications (1)

Publication Number Publication Date
JPS5256034A true JPS5256034A (en) 1977-05-09

Family

ID=9160796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51116683A Pending JPS5256034A (en) 1975-10-03 1976-09-30 Mechanical and chemical etching method and apparatus therefor

Country Status (6)

Country Link
US (1) US4113543A (ja)
JP (1) JPS5256034A (ja)
AU (1) AU504240B2 (ja)
DE (1) DE2643750A1 (ja)
FR (1) FR2326479A1 (ja)
GB (1) GB1556069A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139481A (en) * 1977-05-12 1978-12-05 Hamamatsu Tv Co Ltd Method of producing solar battery
JPS5729140U (ja) * 1980-07-24 1982-02-16
JP2012509599A (ja) * 2008-11-19 2012-04-19 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 半導体ウェーハのエッジを剥離する方法及びシステム

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4158591A (en) * 1978-04-24 1979-06-19 Atlantic Richfield Company Solar cell manufacture
JPS5928036Y2 (ja) * 1980-07-15 1984-08-14 信越化学工業株式会社 化学エツチング処理装置
US5944588A (en) * 1998-06-25 1999-08-31 International Business Machines Corporation Chemical mechanical polisher
JP4509501B2 (ja) * 2003-07-31 2010-07-21 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 円板状部材のエッチング方法及び装置
KR100604051B1 (ko) * 2004-06-30 2006-07-24 동부일렉트로닉스 주식회사 게이트 산화막의 전세정방법
KR100644054B1 (ko) * 2004-12-29 2006-11-10 동부일렉트로닉스 주식회사 세정 장치 및 게이트 산화막의 전세정 방법
CN101981664B (zh) * 2008-03-31 2013-08-28 Memc电子材料有限公司 蚀刻硅晶片边缘的方法
US20120175343A1 (en) 2011-01-12 2012-07-12 Siltronic Corporation Apparatus and method for etching a wafer edge

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1146723B (de) * 1959-03-31 1963-04-04 Ind Gravure Company AEtzvorrichtung fuer Druckzylinder oder gewoelbte Platten
DE1190291B (de) * 1960-12-03 1965-04-01 Siemens Ag Vorrichtung zur AEtzung von runden Halbleiterscheiben
GB1017336A (en) * 1962-03-16 1966-01-19 Ass Elect Ind Improvements in and relating to semi-conductor devices
CA1027465A (en) * 1973-12-19 1978-03-07 Robert J. Walsh Processing of semiconductor wafers
US3964957A (en) * 1973-12-19 1976-06-22 Monsanto Company Apparatus for processing semiconductor wafers
US3951728A (en) * 1974-07-30 1976-04-20 Hitachi, Ltd. Method of treating semiconductor wafers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139481A (en) * 1977-05-12 1978-12-05 Hamamatsu Tv Co Ltd Method of producing solar battery
JPS5729140U (ja) * 1980-07-24 1982-02-16
JP2012509599A (ja) * 2008-11-19 2012-04-19 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 半導体ウェーハのエッジを剥離する方法及びシステム

Also Published As

Publication number Publication date
GB1556069A (en) 1979-11-21
AU1851576A (en) 1978-04-13
FR2326479B1 (ja) 1979-04-06
FR2326479A1 (fr) 1977-04-29
US4113543A (en) 1978-09-12
AU504240B2 (en) 1979-10-04
DE2643750A1 (de) 1977-04-14
DE2643750C2 (ja) 1989-11-23

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