JPS5253732A - Plating method of metallic layer having high melting point - Google Patents

Plating method of metallic layer having high melting point

Info

Publication number
JPS5253732A
JPS5253732A JP12921075A JP12921075A JPS5253732A JP S5253732 A JPS5253732 A JP S5253732A JP 12921075 A JP12921075 A JP 12921075A JP 12921075 A JP12921075 A JP 12921075A JP S5253732 A JPS5253732 A JP S5253732A
Authority
JP
Japan
Prior art keywords
melting point
high melting
plating method
metallic layer
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12921075A
Other languages
Japanese (ja)
Other versions
JPS5838505B2 (en
Inventor
Hajime Murakami
Eiji Yamamoto
Kanji Ootsuka
Mamoru Ootsu
Yoshiharu Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12921075A priority Critical patent/JPS5838505B2/en
Publication of JPS5253732A publication Critical patent/JPS5253732A/en
Publication of JPS5838505B2 publication Critical patent/JPS5838505B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP12921075A 1975-10-29 1975-10-29 Kouyūtenkinzokukushuhenometsukihou Expired JPS5838505B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12921075A JPS5838505B2 (en) 1975-10-29 1975-10-29 Kouyūtenkinzokukushuhenometsukihou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12921075A JPS5838505B2 (en) 1975-10-29 1975-10-29 Kouyūtenkinzokukushuhenometsukihou

Publications (2)

Publication Number Publication Date
JPS5253732A true JPS5253732A (en) 1977-04-30
JPS5838505B2 JPS5838505B2 (en) 1983-08-23

Family

ID=15003845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12921075A Expired JPS5838505B2 (en) 1975-10-29 1975-10-29 Kouyūtenkinzokukushuhenometsukihou

Country Status (1)

Country Link
JP (1) JPS5838505B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340618A (en) * 1981-03-20 1982-07-20 International Business Machines Corporation Process for forming refractory metal layers on ceramic substrate
JPS57152191A (en) * 1981-03-16 1982-09-20 Hitachi Ltd Copper plated circuit ceramic board
US4510179A (en) * 1981-08-18 1985-04-09 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate and the manufacturing process for it
US4559279A (en) * 1983-06-30 1985-12-17 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate
US4590095A (en) * 1985-06-03 1986-05-20 General Electric Company Nickel coating diffusion bonded to metallized ceramic body and coating method
JPS63318134A (en) * 1987-06-22 1988-12-27 Hitachi Ltd Au film composition for wire bonding

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6364631U (en) * 1986-10-17 1988-04-28

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152191A (en) * 1981-03-16 1982-09-20 Hitachi Ltd Copper plated circuit ceramic board
US4340618A (en) * 1981-03-20 1982-07-20 International Business Machines Corporation Process for forming refractory metal layers on ceramic substrate
US4510179A (en) * 1981-08-18 1985-04-09 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate and the manufacturing process for it
US4559279A (en) * 1983-06-30 1985-12-17 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate
US4590095A (en) * 1985-06-03 1986-05-20 General Electric Company Nickel coating diffusion bonded to metallized ceramic body and coating method
JPS63318134A (en) * 1987-06-22 1988-12-27 Hitachi Ltd Au film composition for wire bonding
JPH07120686B2 (en) * 1987-06-22 1995-12-20 株式会社日立製作所 Au film composition for wire bonding

Also Published As

Publication number Publication date
JPS5838505B2 (en) 1983-08-23

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