JPS5238915Y2 - - Google Patents
Info
- Publication number
- JPS5238915Y2 JPS5238915Y2 JP9146972U JP9146972U JPS5238915Y2 JP S5238915 Y2 JPS5238915 Y2 JP S5238915Y2 JP 9146972 U JP9146972 U JP 9146972U JP 9146972 U JP9146972 U JP 9146972U JP S5238915 Y2 JPS5238915 Y2 JP S5238915Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9146972U JPS5238915Y2 (https=) | 1972-08-02 | 1972-08-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9146972U JPS5238915Y2 (https=) | 1972-08-02 | 1972-08-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4947567U JPS4947567U (https=) | 1974-04-25 |
| JPS5238915Y2 true JPS5238915Y2 (https=) | 1977-09-03 |
Family
ID=28280512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9146972U Expired JPS5238915Y2 (https=) | 1972-08-02 | 1972-08-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5238915Y2 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5277376U (https=) * | 1975-12-09 | 1977-06-09 | ||
| JPS622779Y2 (https=) * | 1981-02-27 | 1987-01-22 | ||
| JPS5956751A (ja) * | 1983-08-26 | 1984-04-02 | Hitachi Ltd | 半導体装置 |
| JPS6173355A (ja) * | 1984-09-19 | 1986-04-15 | Hitachi Ltd | 半導体装置 |
| ITMI20111219A1 (it) | 2011-06-30 | 2012-12-31 | St Microelectronics Srl | Sistema con dissipatore di calore condiviso |
| ITMI20111216A1 (it) * | 2011-06-30 | 2012-12-31 | St Microelectronics Srl | Dispositivo elettronico di potenza ad elevata dissipazione di calore e stabilita? |
| ITMI20111214A1 (it) | 2011-06-30 | 2012-12-31 | St Microelectronics Srl | Dispositivo di potenza a spessore ridotto |
| US8723311B2 (en) | 2011-06-30 | 2014-05-13 | Stmicroelectronics S.R.L. | Half-bridge electronic device with common heat sink on mounting surface |
| ITMI20111213A1 (it) | 2011-06-30 | 2012-12-31 | St Microelectronics Srl | Dispositivo elettronico a semi-ponte con dissipatore di calore ausiliario comune |
| ITMI20111208A1 (it) | 2011-06-30 | 2012-12-31 | St Microelectronics Srl | Sistema con dissipatore di calore stabilizzato |
| ITMI20111217A1 (it) | 2011-06-30 | 2012-12-31 | St Microelectronics Srl | Sistema contenitore/dissipatore per componente elettronico |
-
1972
- 1972-08-02 JP JP9146972U patent/JPS5238915Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4947567U (https=) | 1974-04-25 |