JPS5228729B1 - - Google Patents
Info
- Publication number
- JPS5228729B1 JPS5228729B1 JP46024208A JP2420871A JPS5228729B1 JP S5228729 B1 JPS5228729 B1 JP S5228729B1 JP 46024208 A JP46024208 A JP 46024208A JP 2420871 A JP2420871 A JP 2420871A JP S5228729 B1 JPS5228729 B1 JP S5228729B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
- 
        - C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
 
- 
        - C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
 
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| US3026070A | 1970-04-20 | 1970-04-20 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS465053A JPS465053A (cs) | 1971-11-24 | 
| JPS5228729B1 true JPS5228729B1 (cs) | 1977-07-28 | 
Family
ID=21853336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP46024208A Pending JPS5228729B1 (cs) | 1970-04-20 | 1971-04-15 | 
Country Status (3)
| Country | Link | 
|---|---|
| JP (1) | JPS5228729B1 (cs) | 
| CA (1) | CA945305A (cs) | 
| FR (1) | FR2086188A1 (cs) | 
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS5121480B1 (cs) * | 1971-06-18 | 1976-07-02 | ||
| JPS5654336B2 (cs) * | 1974-05-01 | 1981-12-24 | ||
| JPS6047298B2 (ja) * | 1976-12-30 | 1985-10-21 | 大日本印刷株式会社 | 加熱殺菌用包装容器 | 
| JPS5544540A (en) * | 1978-09-22 | 1980-03-28 | Mitsubishi Electric Corp | Electroless plating solution | 
| JP5840454B2 (ja) * | 2011-10-27 | 2016-01-06 | 上村工業株式会社 | 還元型無電解銀めっき液及び還元型無電解銀めっき方法 | 
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| FR1406990A (fr) * | 1963-09-09 | 1965-07-23 | Photocircuits Corp | Perfectionnements à la dorure chimique | 
| JPS5020012B1 (cs) * | 1964-06-24 | 1975-07-11 | ||
| FR1564064A (cs) * | 1968-03-08 | 1969-04-18 | 
- 
        1971
        - 1971-02-05 CA CA104,596A patent/CA945305A/en not_active Expired
- 1971-04-15 JP JP46024208A patent/JPS5228729B1/ja active Pending
- 1971-04-16 FR FR7113512A patent/FR2086188A1/fr active Granted
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPS465053A (cs) | 1971-11-24 | 
| FR2086188A1 (en) | 1971-12-31 | 
| CA945305A (en) | 1974-04-16 | 
| FR2086188B1 (cs) | 1973-12-28 |