JPS5223064B2 - - Google Patents
Info
- Publication number
- JPS5223064B2 JPS5223064B2 JP46104939A JP10493971A JPS5223064B2 JP S5223064 B2 JPS5223064 B2 JP S5223064B2 JP 46104939 A JP46104939 A JP 46104939A JP 10493971 A JP10493971 A JP 10493971A JP S5223064 B2 JPS5223064 B2 JP S5223064B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46104939A JPS5223064B2 (en:Method) | 1971-12-23 | 1971-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46104939A JPS5223064B2 (en:Method) | 1971-12-23 | 1971-12-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4869057A JPS4869057A (en:Method) | 1973-09-20 |
| JPS5223064B2 true JPS5223064B2 (en:Method) | 1977-06-22 |
Family
ID=14394047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46104939A Expired JPS5223064B2 (en:Method) | 1971-12-23 | 1971-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5223064B2 (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59109910A (ja) * | 1982-12-15 | 1984-06-25 | Komatsu Ltd | ロボツトのテイ−チング方法 |
| JPS60132208A (ja) * | 1983-12-21 | 1985-07-15 | Amada Co Ltd | 可動体の移動範囲制御方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5640513B2 (en:Method) * | 1973-12-04 | 1981-09-21 | ||
| JPS5145761A (en) * | 1974-10-18 | 1976-04-19 | Nippon Electric Co | Denkibuhinno setsuzokuhoho |
| JPS5416669A (en) * | 1977-07-07 | 1979-02-07 | Mitsubishi Electric Corp | Method of manufacturing hybrid integrated circuit device |
| JPS58223396A (ja) * | 1982-06-18 | 1983-12-24 | ウラジミ−ル・イオシフオウイツチ・リブシツ | 超小型電子装置に使用するパネルを製造する方法 |
| JP2753746B2 (ja) * | 1989-11-06 | 1998-05-20 | 日本メクトロン株式会社 | Ｉｃ搭載用可撓性回路基板及びその製造法 |
-
1971
- 1971-12-23 JP JP46104939A patent/JPS5223064B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59109910A (ja) * | 1982-12-15 | 1984-06-25 | Komatsu Ltd | ロボツトのテイ−チング方法 |
| JPS60132208A (ja) * | 1983-12-21 | 1985-07-15 | Amada Co Ltd | 可動体の移動範囲制御方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4869057A (en:Method) | 1973-09-20 |