JPS522168A - Composite molding machine - Google Patents

Composite molding machine

Info

Publication number
JPS522168A
JPS522168A JP7655875A JP7655875A JPS522168A JP S522168 A JPS522168 A JP S522168A JP 7655875 A JP7655875 A JP 7655875A JP 7655875 A JP7655875 A JP 7655875A JP S522168 A JPS522168 A JP S522168A
Authority
JP
Japan
Prior art keywords
molding machine
composite molding
fabrication
parallel
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7655875A
Other languages
Japanese (ja)
Other versions
JPS5434668B2 (en
Inventor
Takeshi Shimizu
Katsuhiro Tabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7655875A priority Critical patent/JPS522168A/en
Publication of JPS522168A publication Critical patent/JPS522168A/en
Publication of JPS5434668B2 publication Critical patent/JPS5434668B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve workability by working lead frame unit by simultaneously cutting dam and bending lead in parallel in fabrication of power IC.
JP7655875A 1975-06-24 1975-06-24 Composite molding machine Granted JPS522168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7655875A JPS522168A (en) 1975-06-24 1975-06-24 Composite molding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7655875A JPS522168A (en) 1975-06-24 1975-06-24 Composite molding machine

Publications (2)

Publication Number Publication Date
JPS522168A true JPS522168A (en) 1977-01-08
JPS5434668B2 JPS5434668B2 (en) 1979-10-29

Family

ID=13608569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7655875A Granted JPS522168A (en) 1975-06-24 1975-06-24 Composite molding machine

Country Status (1)

Country Link
JP (1) JPS522168A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014027A (en) * 1973-06-11 1975-02-14
JPS5026234A (en) * 1973-07-06 1975-03-19
JPS53129016U (en) * 1977-03-22 1978-10-13
JPS5534453A (en) * 1978-08-31 1980-03-11 Nec Corp Lead frame for semiconductor device
US4258381A (en) * 1977-12-07 1981-03-24 Steag, Kernergie Gmbh Lead frame for a semiconductor device suitable for mass production
JPS59167361A (en) * 1983-03-15 1984-09-20 株式会社東芝 Omnidirectional travelling car
JPS607199A (en) * 1983-06-27 1985-01-14 株式会社東芝 Handler

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014027A (en) * 1973-06-11 1975-02-14
JPS5335331B2 (en) * 1973-06-11 1978-09-26
JPS5026234A (en) * 1973-07-06 1975-03-19
JPS5336654B2 (en) * 1973-07-06 1978-10-04
JPS53129016U (en) * 1977-03-22 1978-10-13
JPS589768Y2 (en) * 1977-03-22 1983-02-22 ティー・シー・エム株式会社 Traveling device for cargo handling vehicles
US4258381A (en) * 1977-12-07 1981-03-24 Steag, Kernergie Gmbh Lead frame for a semiconductor device suitable for mass production
JPS5534453A (en) * 1978-08-31 1980-03-11 Nec Corp Lead frame for semiconductor device
JPS633463B2 (en) * 1978-08-31 1988-01-23 Nippon Electric Co
JPS59167361A (en) * 1983-03-15 1984-09-20 株式会社東芝 Omnidirectional travelling car
JPS607199A (en) * 1983-06-27 1985-01-14 株式会社東芝 Handler

Also Published As

Publication number Publication date
JPS5434668B2 (en) 1979-10-29

Similar Documents

Publication Publication Date Title
IT1035948B (en) IMPROVEMENT IN MACHINE TOOLS
JPS522168A (en) Composite molding machine
ZA755973B (en) Improvements in or relating to power supply circuit arrangements
IT1025864B (en) PROCESS FOR AGGLOMERATING SODIUM CARBONATE PEROXIDE AND PRODUCED IN THIS WAY OBTAINED
IT1041502B (en) ARRANGEMENT FOR DRIVING TO THE SWINGING POCKET IN THE FRAME OF A PUNCHING MACHINE
JPS51137193A (en) Wire-cutting device making use of electric discharge
JPS5363234A (en) Device for electrochemical working of piece to be worked
JPS5324780A (en) Lead frame
MY8300011A (en) Improvements in or relating to plant growth-regulating compositions
JPS5244482A (en) Wire saw
JPS51147085A (en) Cold sawing machine
JPS5421699A (en) Electric-discharge type boring machine
JPS51142607A (en) This device inserts core end plates to the rotor a small size motor
JPS52135497A (en) Wire cut discharge treatment process
JPS52606A (en) Levee making machine in farm work
JPS5230164A (en) Method for fabrication of lead frame
JPS545635A (en) Semiconductor memory device
AU213008B2 (en) Improvements in or relating to power operated pressing machines
IT1083520B (en) GRINDING MACHINE FOR ANNULAR PIECES TO BE WORKED EXTERNALLY OR INTERNALLY
AU2234256A (en) Improvements in or relating to power operated pressing machines
SE407724B (en) IN ONE PIECE CLEAR PACKAGE RELIEF GENERATION
AU484250B2 (en) Improvements in or relating to pelletising machines
AU208476B2 (en) Improvements in or relating to cutting machines
RO67207A2 (en) MACHINE TO AFFECT MILL TOOLS
JPS53128096A (en) Laser processing device