JPS52159163U - - Google Patents

Info

Publication number
JPS52159163U
JPS52159163U JP1976068383U JP6838376U JPS52159163U JP S52159163 U JPS52159163 U JP S52159163U JP 1976068383 U JP1976068383 U JP 1976068383U JP 6838376 U JP6838376 U JP 6838376U JP S52159163 U JPS52159163 U JP S52159163U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976068383U
Other languages
Japanese (ja)
Other versions
JPS5732590Y2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976068383U priority Critical patent/JPS5732590Y2/ja
Publication of JPS52159163U publication Critical patent/JPS52159163U/ja
Application granted granted Critical
Publication of JPS5732590Y2 publication Critical patent/JPS5732590Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73253Bump and layer connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1976068383U 1976-05-27 1976-05-27 Expired JPS5732590Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976068383U JPS5732590Y2 (en:Method) 1976-05-27 1976-05-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976068383U JPS5732590Y2 (en:Method) 1976-05-27 1976-05-27

Publications (2)

Publication Number Publication Date
JPS52159163U true JPS52159163U (en:Method) 1977-12-02
JPS5732590Y2 JPS5732590Y2 (en:Method) 1982-07-17

Family

ID=28536002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976068383U Expired JPS5732590Y2 (en:Method) 1976-05-27 1976-05-27

Country Status (1)

Country Link
JP (1) JPS5732590Y2 (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS641262A (en) * 1987-06-24 1989-01-05 Hitachi Ltd Electronic device and manufacture thereof
JP2013088678A (ja) * 2011-10-19 2013-05-13 Sumitomo Bakelite Co Ltd 光導波路モジュール、光導波路モジュールの製造方法および電子機器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49118050U (en:Method) * 1973-02-06 1974-10-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49118050U (en:Method) * 1973-02-06 1974-10-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS641262A (en) * 1987-06-24 1989-01-05 Hitachi Ltd Electronic device and manufacture thereof
JP2013088678A (ja) * 2011-10-19 2013-05-13 Sumitomo Bakelite Co Ltd 光導波路モジュール、光導波路モジュールの製造方法および電子機器

Also Published As

Publication number Publication date
JPS5732590Y2 (en:Method) 1982-07-17

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