JPS52152193A - Airtight package - Google Patents

Airtight package

Info

Publication number
JPS52152193A
JPS52152193A JP6954576A JP6954576A JPS52152193A JP S52152193 A JPS52152193 A JP S52152193A JP 6954576 A JP6954576 A JP 6954576A JP 6954576 A JP6954576 A JP 6954576A JP S52152193 A JPS52152193 A JP S52152193A
Authority
JP
Japan
Prior art keywords
airtight package
package
hermetcially
impact
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6954576A
Other languages
Japanese (ja)
Inventor
Kiyoshi Ogino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP6954576A priority Critical patent/JPS52152193A/en
Publication of JPS52152193A publication Critical patent/JPS52152193A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:To obtain a high-impact-resistance and inexpensive crystal unit by simultaneously forming vibration-proof shape in a package of hermetcially sealing an electronic part such as crystal vibrator, etc.
JP6954576A 1976-06-14 1976-06-14 Airtight package Pending JPS52152193A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6954576A JPS52152193A (en) 1976-06-14 1976-06-14 Airtight package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6954576A JPS52152193A (en) 1976-06-14 1976-06-14 Airtight package

Publications (1)

Publication Number Publication Date
JPS52152193A true JPS52152193A (en) 1977-12-17

Family

ID=13405785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6954576A Pending JPS52152193A (en) 1976-06-14 1976-06-14 Airtight package

Country Status (1)

Country Link
JP (1) JPS52152193A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6809916B2 (en) 2000-06-01 2004-10-26 Fujitsu Limited Shock absorbing member capable of absorbing larger impact applied to electronic apparatus
JP2009044599A (en) * 2007-08-10 2009-02-26 Seiko Instruments Inc Method of manufacturing case, piezoelectric vibrator, oscillator, electronic device, and radio clock

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6809916B2 (en) 2000-06-01 2004-10-26 Fujitsu Limited Shock absorbing member capable of absorbing larger impact applied to electronic apparatus
JP2009044599A (en) * 2007-08-10 2009-02-26 Seiko Instruments Inc Method of manufacturing case, piezoelectric vibrator, oscillator, electronic device, and radio clock

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