JPS52137983A - Mounting method of semiconductor tip by tapeecarrier system - Google Patents

Mounting method of semiconductor tip by tapeecarrier system

Info

Publication number
JPS52137983A
JPS52137983A JP5512976A JP5512976A JPS52137983A JP S52137983 A JPS52137983 A JP S52137983A JP 5512976 A JP5512976 A JP 5512976A JP 5512976 A JP5512976 A JP 5512976A JP S52137983 A JPS52137983 A JP S52137983A
Authority
JP
Japan
Prior art keywords
tapeecarrier
mounting method
semiconductor tip
tip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5512976A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5758049B2 (cs
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP5512976A priority Critical patent/JPS52137983A/ja
Publication of JPS52137983A publication Critical patent/JPS52137983A/ja
Publication of JPS5758049B2 publication Critical patent/JPS5758049B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP5512976A 1976-05-14 1976-05-14 Mounting method of semiconductor tip by tapeecarrier system Granted JPS52137983A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5512976A JPS52137983A (en) 1976-05-14 1976-05-14 Mounting method of semiconductor tip by tapeecarrier system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5512976A JPS52137983A (en) 1976-05-14 1976-05-14 Mounting method of semiconductor tip by tapeecarrier system

Publications (2)

Publication Number Publication Date
JPS52137983A true JPS52137983A (en) 1977-11-17
JPS5758049B2 JPS5758049B2 (cs) 1982-12-08

Family

ID=12990149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5512976A Granted JPS52137983A (en) 1976-05-14 1976-05-14 Mounting method of semiconductor tip by tapeecarrier system

Country Status (1)

Country Link
JP (1) JPS52137983A (cs)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552229A (en) * 1978-10-11 1980-04-16 Nec Corp Manufacture of semiconductor device
JPS56103434A (en) * 1980-01-23 1981-08-18 Hitachi Ltd Automatic wire bonding
JPS5818933A (ja) * 1981-07-27 1983-02-03 Shinkawa Ltd インナ−リ−ドボンデイング装置
JPS5864157A (ja) * 1981-10-13 1983-04-16 Toyota Motor Corp 自動水研装置
JP2020053708A (ja) * 2015-03-20 2020-04-02 ロヒンニ リミテッド ライアビリティ カンパニー 半導体デバイスの転写方法
US11069551B2 (en) 2016-11-03 2021-07-20 Rohinni, LLC Method of dampening a force applied to an electrically-actuatable element
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
US11462433B2 (en) 2016-11-23 2022-10-04 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50153872A (cs) * 1974-05-30 1975-12-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50153872A (cs) * 1974-05-30 1975-12-11

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552229A (en) * 1978-10-11 1980-04-16 Nec Corp Manufacture of semiconductor device
JPS56103434A (en) * 1980-01-23 1981-08-18 Hitachi Ltd Automatic wire bonding
JPS5818933A (ja) * 1981-07-27 1983-02-03 Shinkawa Ltd インナ−リ−ドボンデイング装置
JPS5864157A (ja) * 1981-10-13 1983-04-16 Toyota Motor Corp 自動水研装置
JP2020053708A (ja) * 2015-03-20 2020-04-02 ロヒンニ リミテッド ライアビリティ カンパニー 半導体デバイスの転写方法
US11488940B2 (en) 2015-03-20 2022-11-01 Rohinni, Inc. Method for transfer of semiconductor devices onto glass substrates
US11515293B2 (en) 2015-03-20 2022-11-29 Rohinni, LLC Direct transfer of semiconductor devices from a substrate
US11562990B2 (en) 2015-03-20 2023-01-24 Rohinni, Inc. Systems for direct transfer of semiconductor device die
US11069551B2 (en) 2016-11-03 2021-07-20 Rohinni, LLC Method of dampening a force applied to an electrically-actuatable element
US11462433B2 (en) 2016-11-23 2022-10-04 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
US11728195B2 (en) 2018-09-28 2023-08-15 Rohinni, Inc. Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate

Also Published As

Publication number Publication date
JPS5758049B2 (cs) 1982-12-08

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