JPS52127071A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS52127071A
JPS52127071A JP4336476A JP4336476A JPS52127071A JP S52127071 A JPS52127071 A JP S52127071A JP 4336476 A JP4336476 A JP 4336476A JP 4336476 A JP4336476 A JP 4336476A JP S52127071 A JPS52127071 A JP S52127071A
Authority
JP
Japan
Prior art keywords
bonding
wire bonding
bonding apparatus
patterns
enabling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4336476A
Other languages
Japanese (ja)
Other versions
JPS5937575B2 (en
Inventor
Nobuhito Yamazaki
Seiichi Kiyono
Toshikazu Oshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Hitachi Ltd
Original Assignee
Shinkawa Ltd
Hitachi Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Hitachi Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP51043364A priority Critical patent/JPS5937575B2/en
Publication of JPS52127071A publication Critical patent/JPS52127071A/en
Publication of JPS5937575B2 publication Critical patent/JPS5937575B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Abstract

PURPOSE: To improve the working efficiency by previously storing, into data memory, bonding patterns, positional coordinates for bonding points and working conditions for each bonding point thereby enabling the bonding work to be performed based on optional bonding patterns.
COPYRIGHT: (C)1977,JPO&Japio
JP51043364A 1976-04-16 1976-04-16 wire bonding equipment Expired JPS5937575B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51043364A JPS5937575B2 (en) 1976-04-16 1976-04-16 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51043364A JPS5937575B2 (en) 1976-04-16 1976-04-16 wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS52127071A true JPS52127071A (en) 1977-10-25
JPS5937575B2 JPS5937575B2 (en) 1984-09-11

Family

ID=12661788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51043364A Expired JPS5937575B2 (en) 1976-04-16 1976-04-16 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS5937575B2 (en)

Also Published As

Publication number Publication date
JPS5937575B2 (en) 1984-09-11

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