JPS52127068A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS52127068A
JPS52127068A JP4336176A JP4336176A JPS52127068A JP S52127068 A JPS52127068 A JP S52127068A JP 4336176 A JP4336176 A JP 4336176A JP 4336176 A JP4336176 A JP 4336176A JP S52127068 A JPS52127068 A JP S52127068A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding apparatus
eliminate
bonding surface
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4336176A
Other languages
Japanese (ja)
Inventor
Yasunobu Suzuki
Nobuhito Yamazaki
Toshikazu Oshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Hitachi Ltd
Original Assignee
Shinkawa Ltd
Hitachi Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Hitachi Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP4336176A priority Critical patent/JPS52127068A/en
Publication of JPS52127068A publication Critical patent/JPS52127068A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

PURPOSE: To eliminate aligning errors by applying light in perpendicular to the bonding surface to thereby performing easy positioning with distinctive spot light and wide view.
COPYRIGHT: (C)1977,JPO&Japio
JP4336176A 1976-04-16 1976-04-16 Wire bonding apparatus Pending JPS52127068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4336176A JPS52127068A (en) 1976-04-16 1976-04-16 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4336176A JPS52127068A (en) 1976-04-16 1976-04-16 Wire bonding apparatus

Publications (1)

Publication Number Publication Date
JPS52127068A true JPS52127068A (en) 1977-10-25

Family

ID=12661705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4336176A Pending JPS52127068A (en) 1976-04-16 1976-04-16 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS52127068A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5027245U (en) * 1973-07-09 1975-03-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5027245U (en) * 1973-07-09 1975-03-28

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