JPS52126766A - Sealing frame structure for circuit substrate - Google Patents

Sealing frame structure for circuit substrate

Info

Publication number
JPS52126766A
JPS52126766A JP4390576A JP4390576A JPS52126766A JP S52126766 A JPS52126766 A JP S52126766A JP 4390576 A JP4390576 A JP 4390576A JP 4390576 A JP4390576 A JP 4390576A JP S52126766 A JPS52126766 A JP S52126766A
Authority
JP
Japan
Prior art keywords
frame structure
circuit substrate
sealing frame
sealing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4390576A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5551344B2 (xx
Inventor
Toshio Sugita
Nobuo Ukon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP4390576A priority Critical patent/JPS52126766A/ja
Publication of JPS52126766A publication Critical patent/JPS52126766A/ja
Publication of JPS5551344B2 publication Critical patent/JPS5551344B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Clocks (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP4390576A 1976-04-16 1976-04-16 Sealing frame structure for circuit substrate Granted JPS52126766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4390576A JPS52126766A (en) 1976-04-16 1976-04-16 Sealing frame structure for circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4390576A JPS52126766A (en) 1976-04-16 1976-04-16 Sealing frame structure for circuit substrate

Publications (2)

Publication Number Publication Date
JPS52126766A true JPS52126766A (en) 1977-10-24
JPS5551344B2 JPS5551344B2 (xx) 1980-12-23

Family

ID=12676715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4390576A Granted JPS52126766A (en) 1976-04-16 1976-04-16 Sealing frame structure for circuit substrate

Country Status (1)

Country Link
JP (1) JPS52126766A (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54135367A (en) * 1978-04-11 1979-10-20 Seiko Instr & Electronics Circuit block construction for watch

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49125843A (xx) * 1973-04-04 1974-12-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49125843A (xx) * 1973-04-04 1974-12-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54135367A (en) * 1978-04-11 1979-10-20 Seiko Instr & Electronics Circuit block construction for watch
JPS6253792B2 (xx) * 1978-04-11 1987-11-12 Seiko Denshi Kogyo Kk

Also Published As

Publication number Publication date
JPS5551344B2 (xx) 1980-12-23

Similar Documents

Publication Publication Date Title
JPS5335166A (en) Circuit module
HK31881A (en) Carrier correction circuit
JPS52110472A (en) Printed circuit substrate
AU508476B2 (en) Semiconductor circuit
GB1543198A (en) Frames for holding circuit boards
JPS544375A (en) Circuit substrate
JPS51113161A (en) Twoosided printed substrate
JPS5410971A (en) Substrate for multiilayer circuit
JPS538777A (en) Circuit substrate structure
JPS52126766A (en) Sealing frame structure for circuit substrate
GB1548109A (en) Semiconductor components
JPS5367271A (en) Frame for handlamp
GB1523882A (en) Sealing devices
JPS5262655A (en) Thick film module circuit
JPS536882A (en) Thick circuit substrate
JPS52133572A (en) Circuit substrate
JPS5250562A (en) Circuit substrate
JPS52106469A (en) Circuit substrate unit
JPS5331905A (en) Circuit for holding external channel
ZA7775B (en) Sealing devices
AU506495B2 (en) Frame synchronisation circuit
JPS5422573A (en) Thick film circuit substrate
JPS51120144A (en) Circuit module
JPS525468A (en) Circuit substrate
JPS51145571A (en) Foaming substrate