JPS5551344B2 - - Google Patents
Info
- Publication number
- JPS5551344B2 JPS5551344B2 JP4390576A JP4390576A JPS5551344B2 JP S5551344 B2 JPS5551344 B2 JP S5551344B2 JP 4390576 A JP4390576 A JP 4390576A JP 4390576 A JP4390576 A JP 4390576A JP S5551344 B2 JPS5551344 B2 JP S5551344B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4390576A JPS52126766A (en) | 1976-04-16 | 1976-04-16 | Sealing frame structure for circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4390576A JPS52126766A (en) | 1976-04-16 | 1976-04-16 | Sealing frame structure for circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52126766A JPS52126766A (en) | 1977-10-24 |
| JPS5551344B2 true JPS5551344B2 (xx) | 1980-12-23 |
Family
ID=12676715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4390576A Granted JPS52126766A (en) | 1976-04-16 | 1976-04-16 | Sealing frame structure for circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52126766A (xx) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54135367A (en) * | 1978-04-11 | 1979-10-20 | Seiko Instr & Electronics | Circuit block construction for watch |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49125843A (xx) * | 1973-04-04 | 1974-12-02 |
-
1976
- 1976-04-16 JP JP4390576A patent/JPS52126766A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49125843A (xx) * | 1973-04-04 | 1974-12-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52126766A (en) | 1977-10-24 |