JPS52103984A - Light emitting semiconductor indicator device - Google Patents

Light emitting semiconductor indicator device

Info

Publication number
JPS52103984A
JPS52103984A JP1939276A JP1939276A JPS52103984A JP S52103984 A JPS52103984 A JP S52103984A JP 1939276 A JP1939276 A JP 1939276A JP 1939276 A JP1939276 A JP 1939276A JP S52103984 A JPS52103984 A JP S52103984A
Authority
JP
Japan
Prior art keywords
light emitting
indicator device
emitting semiconductor
semiconductor indicator
trunk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1939276A
Other languages
Japanese (ja)
Other versions
JPS5950117B2 (en
Inventor
Toru Nomura
Takeo Senda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP51019392A priority Critical patent/JPS5950117B2/en
Publication of JPS52103984A publication Critical patent/JPS52103984A/en
Publication of JPS5950117B2 publication Critical patent/JPS5950117B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To obtain the band shaped light emitting indicator device suitable for such as a light source of the float, by using a frame which is also acted as an electrode whole shape is that the numbers of short branches are protruded in a certain interval from the one unit of the trunk.
JP51019392A 1976-02-26 1976-02-26 semiconductor float Expired JPS5950117B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51019392A JPS5950117B2 (en) 1976-02-26 1976-02-26 semiconductor float

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51019392A JPS5950117B2 (en) 1976-02-26 1976-02-26 semiconductor float

Publications (2)

Publication Number Publication Date
JPS52103984A true JPS52103984A (en) 1977-08-31
JPS5950117B2 JPS5950117B2 (en) 1984-12-06

Family

ID=11998003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51019392A Expired JPS5950117B2 (en) 1976-02-26 1976-02-26 semiconductor float

Country Status (1)

Country Link
JP (1) JPS5950117B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437502A (en) * 1977-08-30 1979-03-20 Pioneer Electronic Corp Da converter
JPS61100982A (en) * 1984-10-23 1986-05-19 Fuji Electric Co Ltd Collecting display body
JP2018082061A (en) * 2016-11-16 2018-05-24 富士ゼロックス株式会社 Light-emitting element array, and optical transmission device
JP2019161243A (en) * 2019-07-01 2019-09-19 富士ゼロックス株式会社 Light-emitting element array and optical transmission device
CN112385621A (en) * 2020-11-16 2021-02-23 李文亮 Float for fishing device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237464U (en) * 1985-08-26 1987-03-05
JP2589202B2 (en) * 1990-06-29 1997-03-12 三洋電機株式会社 Radio sensitivity switching circuit

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437502A (en) * 1977-08-30 1979-03-20 Pioneer Electronic Corp Da converter
JPS5843933B2 (en) * 1977-08-30 1983-09-30 パイオニア株式会社 D-A converter
JPS61100982A (en) * 1984-10-23 1986-05-19 Fuji Electric Co Ltd Collecting display body
JPH0478192B2 (en) * 1984-10-23 1992-12-10 Fuji Electric Co Ltd
JP2018082061A (en) * 2016-11-16 2018-05-24 富士ゼロックス株式会社 Light-emitting element array, and optical transmission device
US10177532B2 (en) 2016-11-16 2019-01-08 Fuji Xerox Co., Ltd. Light emitting element array and optical transmission device
JP2019161243A (en) * 2019-07-01 2019-09-19 富士ゼロックス株式会社 Light-emitting element array and optical transmission device
CN112385621A (en) * 2020-11-16 2021-02-23 李文亮 Float for fishing device

Also Published As

Publication number Publication date
JPS5950117B2 (en) 1984-12-06

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