JPS5199226A - - Google Patents

Info

Publication number
JPS5199226A
JPS5199226A JP51006350A JP635076A JPS5199226A JP S5199226 A JPS5199226 A JP S5199226A JP 51006350 A JP51006350 A JP 51006350A JP 635076 A JP635076 A JP 635076A JP S5199226 A JPS5199226 A JP S5199226A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51006350A
Other languages
Japanese (ja)
Inventor
Hangusu Uerunaa
Ryuugaa Heriberuto
Sherubaumu Furiidoritsuhi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS5199226A publication Critical patent/JPS5199226A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP51006350A 1975-01-22 1976-01-22 Pending JPS5199226A (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2502472A DE2502472C2 (de) 1975-01-22 1975-01-22 Kühlkörper für Thyristoren

Publications (1)

Publication Number Publication Date
JPS5199226A true JPS5199226A (cs) 1976-09-01

Family

ID=5937013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51006350A Pending JPS5199226A (cs) 1975-01-22 1976-01-22

Country Status (3)

Country Link
JP (1) JPS5199226A (cs)
DE (1) DE2502472C2 (cs)
SE (1) SE7600215L (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103493196A (zh) * 2012-02-06 2014-01-01 华为技术有限公司 具有层叠鳍片的散热片和此散热片的生产方法

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2543397B1 (fr) * 1983-03-25 1985-06-28 Thomson Csf Procede de fabrication d'un dissipateur thermique et un dissipateur thermique obtenu par ce procede
DE3518310A1 (de) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung
DE3703873A1 (de) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr Kuehlkoerper, insbesondere zum kuehlen elektronischer bauelemente
DE3822890A1 (de) * 1988-03-15 1989-09-28 Siemens Ag Kuehlanordnung fuer einen optischen zeichengenerator
AT399791B (de) * 1992-08-06 1995-07-25 Voith Elin Elektronik Ges M B Stromrichter
DE4314663A1 (de) * 1993-05-04 1994-11-10 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente
DE9412460U1 (de) * 1994-08-02 1995-12-14 Hoogovens Aluminium Profiltechnik Gmbh, 88267 Vogt Kühlvorrichtung für elektrische bzw. elektronische Bauelemente mit einer Grundplatte und mit Kühlelementen
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
DE29602367U1 (de) * 1995-03-24 1996-05-15 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Kühlkörper für Halbleiterbauelemente o.dgl.
US5819407A (en) * 1995-04-19 1998-10-13 Tousui, Ltd. Method of joining together a pair of members each having a high thermal conductivity
DE29507286U1 (de) * 1995-05-04 1995-07-20 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente o.dgl. Geräte
GB9509866D0 (en) * 1995-05-16 1995-07-12 Thermalloy Inc A heatsink and a method and an assembly for forming the same
EP0744241B1 (en) * 1995-05-16 2001-11-14 TOUSUI, Ltd. Method of joining together a pair of members each having a high thermal conductivity
GB2300974B (en) * 1995-05-16 1999-12-29 Redpoint Thermalloy Ltd A heatsink and a method of forming the same
DK0789396T3 (da) * 1996-01-31 2006-10-23 Alcan Tech & Man Ag Köleelement til halvlederkomponenter eller lignende
DE29602212U1 (de) * 1996-02-09 1996-05-02 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Kühlkörper für Halbleiterbauelemente o.dgl. Einrichtungen
EP0800890A1 (en) * 1996-04-08 1997-10-15 Tousui Ltd Heat sink
DE29618794U1 (de) * 1996-10-29 1997-06-19 Leber, Dieter, Dipl.-Ing., 91207 Lauf Stranggepreßter Profilkühlkörper für Leistungshalbleiter
US6059017A (en) * 1998-04-20 2000-05-09 The United States Of America As Represented By The Secretary Of The Navy Directional heat exchanger
TW376171U (en) * 1998-11-24 1999-12-01 Foxconn Prec Components Co Ltd Radiating device
US6520248B2 (en) * 2000-05-18 2003-02-18 Aavid Thermalloy Llc Heat sink having bonded cooling fins
DE10056387B4 (de) * 2000-11-14 2008-11-13 Corus Aluminium Profiltechnik Gmbh Kühlvorrichtung und Verfahren zu deren Herstellung sowie Vorrichtung zur Durchführung des Verfahrens
DE10157240B4 (de) * 2001-11-22 2012-10-25 Aleris Aluminum Vogt Gmbh Kühlkörper und Verfahren zur Herstellung desselben
DE10200019B4 (de) 2002-01-02 2006-07-06 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente, Verfahren zu dessen Herstellung und Werkzeug zur Durchführung des Verfahrens
DE10229532B4 (de) * 2002-07-01 2008-06-19 Alcan Technology & Management Ag Kühlvorrichtung für Halbleiterbauelemente
DE102005007041A1 (de) 2005-02-15 2006-08-17 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente oder dgl. Einrichtungen sowie Verfahren zu dessen Herstellung
DE502007001066D1 (de) 2006-11-22 2009-08-27 Alcan Tech & Man Ag Kühlkörper für Halbleiterbauelemente oder dergleichen Wärmequellen sowie Verfahren zu dessen Herstellung
EP2027948A1 (de) * 2007-08-20 2009-02-25 Alcan Technology & Management AG Verfahren zum Herstellen eines Flachprofils, insbesondere eines Kühlkörpers für Halbleiterelemente od.dgl. Bauteile, sowie Profil dazu
DE102008030110A1 (de) 2008-04-22 2009-10-29 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente aus einer stranggepressten Aluminiumlegierung
JP6315081B2 (ja) * 2014-03-18 2018-04-25 富士電機株式会社 電力変換装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1959094A1 (de) * 1969-11-25 1971-05-27 Licentia Gmbh Verfahren zur Herstellung von Halbleiteranordnungen
DE2132139C3 (de) * 1971-06-29 1974-10-24 Merkur Gmbh Metallwerk Anwendung des Kaltpreßschweißverfahrens zum Verbinden zweier gegeneinander gepreßter Werkstückteile

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103493196A (zh) * 2012-02-06 2014-01-01 华为技术有限公司 具有层叠鳍片的散热片和此散热片的生产方法

Also Published As

Publication number Publication date
DE2502472C2 (de) 1982-09-02
DE2502472A1 (de) 1976-07-29
SE7600215L (sv) 1976-07-23

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