JPS5198965A - - Google Patents
Info
- Publication number
- JPS5198965A JPS5198965A JP50022914A JP2291475A JPS5198965A JP S5198965 A JPS5198965 A JP S5198965A JP 50022914 A JP50022914 A JP 50022914A JP 2291475 A JP2291475 A JP 2291475A JP S5198965 A JPS5198965 A JP S5198965A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50022914A JPS5198965A (en) | 1975-02-26 | 1975-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50022914A JPS5198965A (en) | 1975-02-26 | 1975-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5198965A true JPS5198965A (en) | 1976-08-31 |
Family
ID=12095897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50022914A Pending JPS5198965A (en) | 1975-02-26 | 1975-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5198965A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54140468A (en) * | 1978-04-24 | 1979-10-31 | Hitachi Ltd | Glass sealing package type device and its manufacture |
| JPS58129648U (en) * | 1982-02-25 | 1983-09-02 | 日本電気ホームエレクトロニクス株式会社 | Lead bending and cutting equipment for electronic components |
| JPS61179756U (en) * | 1985-04-30 | 1986-11-10 | ||
| JPS6242551A (en) * | 1985-08-20 | 1987-02-24 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1975
- 1975-02-26 JP JP50022914A patent/JPS5198965A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54140468A (en) * | 1978-04-24 | 1979-10-31 | Hitachi Ltd | Glass sealing package type device and its manufacture |
| JPS58129648U (en) * | 1982-02-25 | 1983-09-02 | 日本電気ホームエレクトロニクス株式会社 | Lead bending and cutting equipment for electronic components |
| JPS61179756U (en) * | 1985-04-30 | 1986-11-10 | ||
| JPS6242551A (en) * | 1985-08-20 | 1987-02-24 | Fujitsu Ltd | Manufacture of semiconductor device |