JPS58129648U - Lead bending and cutting equipment for electronic components - Google Patents

Lead bending and cutting equipment for electronic components

Info

Publication number
JPS58129648U
JPS58129648U JP2685482U JP2685482U JPS58129648U JP S58129648 U JPS58129648 U JP S58129648U JP 2685482 U JP2685482 U JP 2685482U JP 2685482 U JP2685482 U JP 2685482U JP S58129648 U JPS58129648 U JP S58129648U
Authority
JP
Japan
Prior art keywords
lead
bending
electronic component
pad
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2685482U
Other languages
Japanese (ja)
Inventor
和弘 西田
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP2685482U priority Critical patent/JPS58129648U/en
Publication of JPS58129648U publication Critical patent/JPS58129648U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Bending Of Plates, Rods, And Pipes (AREA)
  • Wire Processing (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施対象とする電子部品の一例を示す
斜視図、第２図はそれを曲げ切断して屈曲部を形成した
電子部品の側面図、第３図は本考案の一実施例装置を示
す正面図、第４図はその曲げダイに電子部品に載せた状
態を示す斜視図、第５図は本考案の一実施例装置で電子
部品リードの曲げ切断を行った状態を示す正面図である
。 １・・・・・・電子部品、２・・・・・・リード、２′
・・・・・・リード根部、３・・・・・・屈曲部、４・
・・・・・樹脂モールド部、５・・・・・・曲げダイ、
６・・・・・・位置決め部、７・・・・・・リード−曲
げ溝、９・・・・・・パッド、１０・、・・・・・曲け
゛パンチ、１２・・・・・・カッター。Figure 1 is a perspective view showing an example of an electronic component to which the present invention is applied, Figure 2 is a side view of an electronic component formed by bending and cutting it to form a bent part, and Figure 3 is an example of an embodiment of the present invention. FIG. 4 is a front view showing an example device; FIG. 4 is a perspective view showing an electronic component placed on the bending die; FIG. 5 is a diagram showing an electronic component lead being bent and cut using an example device of the present invention. It is a front view. 1...Electronic component, 2...Lead, 2'
...Lead root, 3...Bent part, 4.
... Resin mold part, 5 ... Bending die,
6...Positioning part, 7...Lead-bending groove, 9...Pad, 10...Bending punch, 12...Cutter .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品の位置決め部及びリード曲げ溝を有する曲げタ
イと、電子部品のリード根部を曲げタイに抑圧・固定す
るパッドと、パッドにより曲げダイに押圧・固定された
電子部品のリードをリード曲げ溝内に押し込んで屈曲す
る曲げパンチと、パッド及び曲げパンチにて固定された
状態の電子部品のリードを、所定位置で切断するカッタ
ーとを具備したことを特徴とする電子部品のリード曲げ
切断装置。A bending tie that has an electronic component positioning part and a lead bending groove, a pad that suppresses and fixes the root part of the lead of the electronic component to the bending tie, and a pad that suppresses and fixes the lead of the electronic component to the bending die by the pad into the lead bending groove. 1. A lead bending/cutting device for an electronic component, comprising: a bending punch that bends the lead by pushing the lead into the pad; and a cutter that cuts the lead of the electronic component fixed by the pad and the bending punch at a predetermined position.
JP2685482U 1982-02-25 1982-02-25 Lead bending and cutting equipment for electronic components Pending JPS58129648U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2685482U JPS58129648U (en) 1982-02-25 1982-02-25 Lead bending and cutting equipment for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2685482U JPS58129648U (en) 1982-02-25 1982-02-25 Lead bending and cutting equipment for electronic components

Publications (1)

Publication Number Publication Date
JPS58129648U true JPS58129648U (en) 1983-09-02

Family

ID=30038785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2685482U Pending JPS58129648U (en) 1982-02-25 1982-02-25 Lead bending and cutting equipment for electronic components

Country Status (1)

Country Link
JP (1) JPS58129648U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198966A (en) * 1975-02-26 1976-08-31
JPS5198965A (en) * 1975-02-26 1976-08-31

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198966A (en) * 1975-02-26 1976-08-31
JPS5198965A (en) * 1975-02-26 1976-08-31

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