JPS61179756U - - Google Patents
Info
- Publication number
- JPS61179756U JPS61179756U JP6431885U JP6431885U JPS61179756U JP S61179756 U JPS61179756 U JP S61179756U JP 6431885 U JP6431885 U JP 6431885U JP 6431885 U JP6431885 U JP 6431885U JP S61179756 U JPS61179756 U JP S61179756U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- pair
- cutting
- dip type
- comb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009415 formwork Methods 0.000 claims description 2
- 244000126211 Hericium coralloides Species 0.000 description 1
Landscapes
- Shearing Machines (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例による金型の要部を示
す一部省略斜視図、第２図はＤＩＰリードフレー
ムの一部省略平面図、第３図はＳＩＰリードフレ
ームの一部省略平面図である。
２……リード型枠部、３……リード、３ａ……
リード先端部、５……タイバー、２０……金型、
２１……切断刃、２２……櫛歯部、Ｓ……ＳＩＰ
リードフレーム。
Fig. 1 is a partially omitted perspective view showing the main parts of a mold according to an embodiment of the present invention, Fig. 2 is a partially omitted plan view of a DIP lead frame, and Fig. 3 is a partially omitted plan view of a SIP lead frame. It is. 2...Lead formwork part, 3...Lead, 3a...
Lead tip, 5... tie bar, 20... mold,
21... Cutting blade, 22... Comb tooth section, S... SIP
Lead frame.
Claims (1)
用リードフレームとに共用され、かつ、ＤＩＰ形
ＩＣ用リードフレームに設けられた互いに対称な
一対のリード型枠部にそれぞれ櫛歯状に多数設け
られているリードの先端部同士を連結する、タイ
バーを切断除去する一対の切断刃を備えたリード
フレーム切断用金型において、 一対の切断刃の少なくとも一方が櫛歯状に形成
されていることを特徴とするリードフレーム切断
用金型。[Claims for Utility Model Registration] Lead frame for SIP type IC and DIP type IC
A tie bar is used in common with the DIP type IC lead frame, and connects the tip ends of the leads that are provided in a comb-like shape in a pair of mutually symmetrical lead formwork parts provided on the DIP type IC lead frame. What is claimed is: 1. A lead frame cutting mold equipped with a pair of cutting blades for cutting and removing a lead frame, wherein at least one of the pair of cutting blades is formed in a comb-teeth shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6431885U JPS61179756U (en) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6431885U JPS61179756U (en) | 1985-04-30 | 1985-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61179756U true JPS61179756U (en) | 1986-11-10 |
Family
ID=30595290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6431885U Pending JPS61179756U (en) | 1985-04-30 | 1985-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61179756U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04750A (en) * | 1990-04-18 | 1992-01-06 | Toshiba Corp | Lead frame for semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5198966A (en) * | 1975-02-26 | 1976-08-31 | ||
| JPS5198965A (en) * | 1975-02-26 | 1976-08-31 | ||
| JPS56158462A (en) * | 1980-05-12 | 1981-12-07 | Fujitsu Ltd | Lead frame for single inline semiconductor device |
-
1985
- 1985-04-30 JP JP6431885U patent/JPS61179756U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5198966A (en) * | 1975-02-26 | 1976-08-31 | ||
| JPS5198965A (en) * | 1975-02-26 | 1976-08-31 | ||
| JPS56158462A (en) * | 1980-05-12 | 1981-12-07 | Fujitsu Ltd | Lead frame for single inline semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04750A (en) * | 1990-04-18 | 1992-01-06 | Toshiba Corp | Lead frame for semiconductor device |
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