JPS5198957A - - Google Patents

Info

Publication number
JPS5198957A
JPS5198957A JP50023752A JP2375275A JPS5198957A JP S5198957 A JPS5198957 A JP S5198957A JP 50023752 A JP50023752 A JP 50023752A JP 2375275 A JP2375275 A JP 2375275A JP S5198957 A JPS5198957 A JP S5198957A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50023752A
Other languages
Japanese (ja)
Other versions
JPS5847851B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP50023752A priority Critical patent/JPS5847851B2/ja
Publication of JPS5198957A publication Critical patent/JPS5198957A/ja
Publication of JPS5847851B2 publication Critical patent/JPS5847851B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
JP50023752A 1975-02-26 1975-02-26 チタン層を有する半導体素子の製造方法 Expired JPS5847851B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50023752A JPS5847851B2 (ja) 1975-02-26 1975-02-26 チタン層を有する半導体素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50023752A JPS5847851B2 (ja) 1975-02-26 1975-02-26 チタン層を有する半導体素子の製造方法

Publications (2)

Publication Number Publication Date
JPS5198957A true JPS5198957A (zh) 1976-08-31
JPS5847851B2 JPS5847851B2 (ja) 1983-10-25

Family

ID=12119035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50023752A Expired JPS5847851B2 (ja) 1975-02-26 1975-02-26 チタン層を有する半導体素子の製造方法

Country Status (1)

Country Link
JP (1) JPS5847851B2 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6193629A (ja) * 1984-10-15 1986-05-12 Nec Corp 半導体装置の製造方法
JPS6340367A (ja) * 1986-08-05 1988-02-20 Mitsubishi Electric Corp 半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6193629A (ja) * 1984-10-15 1986-05-12 Nec Corp 半導体装置の製造方法
JPH0451050B2 (zh) * 1984-10-15 1992-08-18 Nippon Electric Co
JPS6340367A (ja) * 1986-08-05 1988-02-20 Mitsubishi Electric Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS5847851B2 (ja) 1983-10-25

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