JPS5195785A - - Google Patents

Info

Publication number
JPS5195785A
JPS5195785A JP51003112A JP311276A JPS5195785A JP S5195785 A JPS5195785 A JP S5195785A JP 51003112 A JP51003112 A JP 51003112A JP 311276 A JP311276 A JP 311276A JP S5195785 A JPS5195785 A JP S5195785A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51003112A
Other languages
Japanese (ja)
Other versions
JPS5346701B2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5195785A publication Critical patent/JPS5195785A/ja
Publication of JPS5346701B2 publication Critical patent/JPS5346701B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/03—Manufacture or treatment wherein the substrate comprises sapphire, e.g. silicon-on-sapphire [SOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
  • Thin Film Transistor (AREA)
JP311276A 1975-01-13 1976-01-12 Expired JPS5346701B2 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54044375A 1975-01-13 1975-01-13

Publications (2)

Publication Number Publication Date
JPS5195785A true JPS5195785A (cg-RX-API-DMAC7.html) 1976-08-21
JPS5346701B2 JPS5346701B2 (cg-RX-API-DMAC7.html) 1978-12-15

Family

ID=24155496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP311276A Expired JPS5346701B2 (cg-RX-API-DMAC7.html) 1975-01-13 1976-01-12

Country Status (11)

Country Link
JP (1) JPS5346701B2 (cg-RX-API-DMAC7.html)
BE (1) BE837382A (cg-RX-API-DMAC7.html)
CA (1) CA1040320A (cg-RX-API-DMAC7.html)
CH (1) CH598695A5 (cg-RX-API-DMAC7.html)
DE (1) DE2600221B2 (cg-RX-API-DMAC7.html)
FR (1) FR2297496A1 (cg-RX-API-DMAC7.html)
GB (1) GB1509949A (cg-RX-API-DMAC7.html)
IN (1) IN144889B (cg-RX-API-DMAC7.html)
IT (1) IT1049016B (cg-RX-API-DMAC7.html)
NL (1) NL7600259A (cg-RX-API-DMAC7.html)
SE (1) SE408508B (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008504685A (ja) * 2004-06-23 2008-02-14 マイクロン テクノロジー,インコーポレイテッド Al2O3誘電体を用いるメモリ・セルの絶縁構造

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4448632A (en) * 1981-05-25 1984-05-15 Mitsubishi Denki Kabushiki Kaisha Method of fabricating semiconductor devices
JP2011119397A (ja) * 2009-12-02 2011-06-16 Canon Inc 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008504685A (ja) * 2004-06-23 2008-02-14 マイクロン テクノロジー,インコーポレイテッド Al2O3誘電体を用いるメモリ・セルの絶縁構造

Also Published As

Publication number Publication date
CA1040320A (en) 1978-10-10
DE2600221A1 (de) 1976-07-15
DE2600221B2 (de) 1978-09-07
SE7600122L (sv) 1976-07-14
IT1049016B (it) 1981-01-20
GB1509949A (en) 1978-05-10
SE408508B (sv) 1979-06-11
IN144889B (cg-RX-API-DMAC7.html) 1978-07-22
FR2297496A1 (fr) 1976-08-06
NL7600259A (nl) 1976-07-15
CH598695A5 (cg-RX-API-DMAC7.html) 1978-05-12
JPS5346701B2 (cg-RX-API-DMAC7.html) 1978-12-15
BE837382A (nl) 1976-05-03

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