JPS5188184A - - Google Patents
Info
- Publication number
- JPS5188184A JPS5188184A JP50152700A JP15270075A JPS5188184A JP S5188184 A JPS5188184 A JP S5188184A JP 50152700 A JP50152700 A JP 50152700A JP 15270075 A JP15270075 A JP 15270075A JP S5188184 A JPS5188184 A JP S5188184A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
- H10W40/613—Bolts or screws for stacked arrangements of a plurality of semiconductor devices
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2460631A DE2460631C3 (de) | 1974-12-20 | 1974-12-20 | Kuhlkörper zur Fremdkuhlung von Thyristoren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5188184A true JPS5188184A (enExample) | 1976-08-02 |
Family
ID=5934129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50152700A Pending JPS5188184A (enExample) | 1974-12-20 | 1975-12-19 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5188184A (enExample) |
| DE (1) | DE2460631C3 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007243473A (ja) * | 2006-03-07 | 2007-09-20 | Fujitsu Media Device Kk | 弾性境界波デバイス |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6138237Y2 (enExample) * | 1978-11-17 | 1986-11-05 | ||
| US4365665A (en) * | 1978-11-17 | 1982-12-28 | Sumitomo Precision Products Company, Ltd. | Heat sink |
| DE3415554A1 (de) * | 1983-04-30 | 1984-10-31 | Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid | Kuehlkoerper fuer leistungselektronische bauelemente |
| US4683489A (en) * | 1984-08-08 | 1987-07-28 | Siemens Aktiengesellschaft | Common housing for two semi-conductor bodies |
| EP0174537A1 (de) * | 1984-09-10 | 1986-03-19 | Siemens Aktiengesellschaft | Im Betrieb von einem Kühlmedium umströmter federnder Kühlkörper |
| AT399791B (de) * | 1992-08-06 | 1995-07-25 | Voith Elin Elektronik Ges M B | Stromrichter |
| DE4314663A1 (de) * | 1993-05-04 | 1994-11-10 | Alusuisse Lonza Services Ag | Kühlkörper für Halbleiterbauelemente |
| GB2339897A (en) * | 1998-07-20 | 2000-02-09 | Ben Kibel | A Heat sink |
| US6081427A (en) * | 1999-09-30 | 2000-06-27 | Rockwell Technologies, Llc | Retainer for press-pack semi-conductor device |
| CN105493273B (zh) * | 2014-03-18 | 2019-11-05 | 富士电机株式会社 | 功率转换装置 |
-
1974
- 1974-12-20 DE DE2460631A patent/DE2460631C3/de not_active Expired
-
1975
- 1975-12-19 JP JP50152700A patent/JPS5188184A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007243473A (ja) * | 2006-03-07 | 2007-09-20 | Fujitsu Media Device Kk | 弾性境界波デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2460631B2 (enExample) | 1978-07-27 |
| DE2460631A1 (de) | 1976-07-01 |
| DE2460631C3 (de) | 1979-04-05 |