JPS5188184A - - Google Patents
Info
- Publication number
- JPS5188184A JPS5188184A JP50152700A JP15270075A JPS5188184A JP S5188184 A JPS5188184 A JP S5188184A JP 50152700 A JP50152700 A JP 50152700A JP 15270075 A JP15270075 A JP 15270075A JP S5188184 A JPS5188184 A JP S5188184A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19742460631 DE2460631C3 (de) | 1974-12-20 | 1974-12-20 | Kuhlkörper zur Fremdkuhlung von Thyristoren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5188184A true JPS5188184A (enrdf_load_stackoverflow) | 1976-08-02 |
Family
ID=5934129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50152700A Pending JPS5188184A (enrdf_load_stackoverflow) | 1974-12-20 | 1975-12-19 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5188184A (enrdf_load_stackoverflow) |
| DE (1) | DE2460631C3 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007243473A (ja) * | 2006-03-07 | 2007-09-20 | Fujitsu Media Device Kk | 弾性境界波デバイス |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4365665A (en) * | 1978-11-17 | 1982-12-28 | Sumitomo Precision Products Company, Ltd. | Heat sink |
| JPS6138237Y2 (enrdf_load_stackoverflow) * | 1978-11-17 | 1986-11-05 | ||
| DE3415554A1 (de) * | 1983-04-30 | 1984-10-31 | Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid | Kuehlkoerper fuer leistungselektronische bauelemente |
| ATE40022T1 (de) * | 1984-08-08 | 1989-01-15 | Siemens Ag | Gemeinsames gehaeuse fuer zwei halbleiterkoerper. |
| EP0174537A1 (de) * | 1984-09-10 | 1986-03-19 | Siemens Aktiengesellschaft | Im Betrieb von einem Kühlmedium umströmter federnder Kühlkörper |
| AT399791B (de) * | 1992-08-06 | 1995-07-25 | Voith Elin Elektronik Ges M B | Stromrichter |
| DE4314663A1 (de) * | 1993-05-04 | 1994-11-10 | Alusuisse Lonza Services Ag | Kühlkörper für Halbleiterbauelemente |
| GB2339897A (en) * | 1998-07-20 | 2000-02-09 | Ben Kibel | A Heat sink |
| US6081427A (en) * | 1999-09-30 | 2000-06-27 | Rockwell Technologies, Llc | Retainer for press-pack semi-conductor device |
| WO2015141305A1 (ja) * | 2014-03-18 | 2015-09-24 | 富士電機株式会社 | 電力変換装置 |
-
1974
- 1974-12-20 DE DE19742460631 patent/DE2460631C3/de not_active Expired
-
1975
- 1975-12-19 JP JP50152700A patent/JPS5188184A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007243473A (ja) * | 2006-03-07 | 2007-09-20 | Fujitsu Media Device Kk | 弾性境界波デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2460631A1 (de) | 1976-07-01 |
| DE2460631B2 (enrdf_load_stackoverflow) | 1978-07-27 |
| DE2460631C3 (de) | 1979-04-05 |