JPS5187964A - - Google Patents
Info
- Publication number
- JPS5187964A JPS5187964A JP50012561A JP1256175A JPS5187964A JP S5187964 A JPS5187964 A JP S5187964A JP 50012561 A JP50012561 A JP 50012561A JP 1256175 A JP1256175 A JP 1256175A JP S5187964 A JPS5187964 A JP S5187964A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50012561A JPS5187964A (enrdf_load_stackoverflow) | 1975-01-31 | 1975-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50012561A JPS5187964A (enrdf_load_stackoverflow) | 1975-01-31 | 1975-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5187964A true JPS5187964A (enrdf_load_stackoverflow) | 1976-07-31 |
Family
ID=11808749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50012561A Pending JPS5187964A (enrdf_load_stackoverflow) | 1975-01-31 | 1975-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5187964A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5890752A (ja) * | 1981-11-25 | 1983-05-30 | Nec Corp | 半導体装置の製造方法 |
| JPH01184840A (ja) * | 1988-01-13 | 1989-07-24 | Mitsui High Tec Inc | ワイヤレスボンディング方法 |
| JP4926950B2 (ja) * | 2004-05-10 | 2012-05-09 | ジョン、エイチ．ストックトン | 真空掃除機用の伸縮ホースエクステンション |
-
1975
- 1975-01-31 JP JP50012561A patent/JPS5187964A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5890752A (ja) * | 1981-11-25 | 1983-05-30 | Nec Corp | 半導体装置の製造方法 |
| JPH01184840A (ja) * | 1988-01-13 | 1989-07-24 | Mitsui High Tec Inc | ワイヤレスボンディング方法 |
| JP4926950B2 (ja) * | 2004-05-10 | 2012-05-09 | ジョン、エイチ．ストックトン | 真空掃除機用の伸縮ホースエクステンション |