JPS5185669A - - Google Patents
Info
- Publication number
- JPS5185669A JPS5185669A JP50010525A JP1052575A JPS5185669A JP S5185669 A JPS5185669 A JP S5185669A JP 50010525 A JP50010525 A JP 50010525A JP 1052575 A JP1052575 A JP 1052575A JP S5185669 A JPS5185669 A JP S5185669A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/50—
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/075—
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- H10W72/522—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/552—
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- H10W72/5522—
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- H10W72/555—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1052575A JPS5423794B2 (esLanguage) | 1975-01-27 | 1975-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1052575A JPS5423794B2 (esLanguage) | 1975-01-27 | 1975-01-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5185669A true JPS5185669A (esLanguage) | 1976-07-27 |
| JPS5423794B2 JPS5423794B2 (esLanguage) | 1979-08-16 |
Family
ID=11752652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1052575A Expired JPS5423794B2 (esLanguage) | 1975-01-27 | 1975-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5423794B2 (esLanguage) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5614650U (esLanguage) * | 1979-07-14 | 1981-02-07 | ||
| JPS56169341A (en) * | 1980-05-31 | 1981-12-26 | Tanaka Kikinzoku Kogyo Kk | Bonding wire for semiconductor element |
| US6711925B2 (en) * | 2001-12-17 | 2004-03-30 | Asep Tec Co., Ltd. | Process for manufacturing a conductive wire suitable for use in semiconductor packages |
| WO2013129253A1 (ja) * | 2012-02-27 | 2013-09-06 | 日鉄住金マイクロメタル株式会社 | パワー半導体装置及びその製造方法並びにボンディングワイヤ |
| KR20160007663A (ko) | 2014-01-31 | 2016-01-20 | 다츠다 덴센 가부시키가이샤 | 와이어 본딩 및 그 제조 방법 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101687597B1 (ko) * | 2015-01-19 | 2016-12-20 | 엠케이전자 주식회사 | 본딩 와이어 |
-
1975
- 1975-01-27 JP JP1052575A patent/JPS5423794B2/ja not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5614650U (esLanguage) * | 1979-07-14 | 1981-02-07 | ||
| JPS56169341A (en) * | 1980-05-31 | 1981-12-26 | Tanaka Kikinzoku Kogyo Kk | Bonding wire for semiconductor element |
| US6711925B2 (en) * | 2001-12-17 | 2004-03-30 | Asep Tec Co., Ltd. | Process for manufacturing a conductive wire suitable for use in semiconductor packages |
| WO2013129253A1 (ja) * | 2012-02-27 | 2013-09-06 | 日鉄住金マイクロメタル株式会社 | パワー半導体装置及びその製造方法並びにボンディングワイヤ |
| JP5728126B2 (ja) * | 2012-02-27 | 2015-06-03 | 日鉄住金マイクロメタル株式会社 | パワー半導体装置及びその製造方法並びにボンディングワイヤ |
| US9059003B2 (en) | 2012-02-27 | 2015-06-16 | Nippon Micrometal Corporation | Power semiconductor device, method of manufacturing the device and bonding wire |
| KR20160007663A (ko) | 2014-01-31 | 2016-01-20 | 다츠다 덴센 가부시키가이샤 | 와이어 본딩 및 그 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5423794B2 (esLanguage) | 1979-08-16 |