JPS515345B1 - - Google Patents

Info

Publication number
JPS515345B1
JPS515345B1 JP9045870A JP9045870A JPS515345B1 JP S515345 B1 JPS515345 B1 JP S515345B1 JP 9045870 A JP9045870 A JP 9045870A JP 9045870 A JP9045870 A JP 9045870A JP S515345 B1 JPS515345 B1 JP S515345B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9045870A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9045870A priority Critical patent/JPS515345B1/ja
Publication of JPS515345B1 publication Critical patent/JPS515345B1/ja
Pending legal-status Critical Current

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  • ing And Chemical Polishing (AREA)
JP9045870A 1970-10-16 1970-10-16 Pending JPS515345B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9045870A JPS515345B1 (en) 1970-10-16 1970-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9045870A JPS515345B1 (en) 1970-10-16 1970-10-16

Publications (1)

Publication Number Publication Date
JPS515345B1 true JPS515345B1 (en) 1976-02-19

Family

ID=13999157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9045870A Pending JPS515345B1 (en) 1970-10-16 1970-10-16

Country Status (1)

Country Link
JP (1) JPS515345B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0633268A (en) * 1992-07-16 1994-02-08 Asahi Denka Kogyo Kk Surface treating method of copper and copper alloy
JP2009057624A (en) * 2007-09-03 2009-03-19 Meltex Inc Chemical polishing agent and metal plating method using copper or copper alloy treated before plating using the chemical polishing agent
JP2009132967A (en) * 2007-11-30 2009-06-18 Meltex Inc Acid degreasing agent used for pretreatment of electrolytic copper plating to surface of copper or copper alloy, and electrolytic copper plating method to surface of copper or copper alloy pretreated using the acid degreasing agent

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0633268A (en) * 1992-07-16 1994-02-08 Asahi Denka Kogyo Kk Surface treating method of copper and copper alloy
JP2009057624A (en) * 2007-09-03 2009-03-19 Meltex Inc Chemical polishing agent and metal plating method using copper or copper alloy treated before plating using the chemical polishing agent
JP2009132967A (en) * 2007-11-30 2009-06-18 Meltex Inc Acid degreasing agent used for pretreatment of electrolytic copper plating to surface of copper or copper alloy, and electrolytic copper plating method to surface of copper or copper alloy pretreated using the acid degreasing agent

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