JPS5148992A - - Google Patents

Info

Publication number
JPS5148992A
JPS5148992A JP9941075A JP9941075A JPS5148992A JP S5148992 A JPS5148992 A JP S5148992A JP 9941075 A JP9941075 A JP 9941075A JP 9941075 A JP9941075 A JP 9941075A JP S5148992 A JPS5148992 A JP S5148992A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9941075A
Inventor
Jooji Kurafuoodo Magunasu
Taunzendo Beirii Hooru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Co
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of JPS5148992A publication Critical patent/JPS5148992A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/038—Diffusions-staged
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/065—Gp III-V generic compounds-processing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/072—Heterojunctions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/099—LED, multicolor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/119—Phosphides of gallium or indium
JP9941075A 1974-08-16 1975-08-15 Pending JPS5148992A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/497,992 US3947840A (en) 1974-08-16 1974-08-16 Integrated semiconductor light-emitting display array

Publications (1)

Publication Number Publication Date
JPS5148992A true JPS5148992A (ja) 1976-04-27

Family

ID=23979173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9941075A Pending JPS5148992A (ja) 1974-08-16 1975-08-15

Country Status (3)

Country Link
US (1) US3947840A (ja)
JP (1) JPS5148992A (ja)
CA (1) CA1050644A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5398180U (ja) * 1977-01-11 1978-08-09
JPS55165729A (en) * 1979-06-13 1980-12-24 Unitika Ltd Excretion treatment of pig
JPS56126983A (en) * 1980-03-12 1981-10-05 Oki Electric Ind Co Ltd Semiconductor light emitting device

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CA1023835A (en) * 1974-07-08 1978-01-03 Tadao Nakamura Light emitting gallium phosphide device
GB1487945A (en) * 1974-11-20 1977-10-05 Ibm Semiconductor integrated circuit devices
US4086514A (en) * 1975-09-15 1978-04-25 Karel Havel Variable color display device
US4198251A (en) * 1975-09-18 1980-04-15 U.S. Philips Corporation Method of making polychromatic monolithic electroluminescent assembly utilizing epitaxial deposition of graded layers
FR2325195A1 (fr) * 1975-09-18 1977-04-15 Radiotechnique Compelec Ensemble monolithique semiconducteur electroluminescent
US4048632A (en) * 1976-03-05 1977-09-13 Rockwell International Corporation Drive circuit for a display
FR2361790A1 (fr) * 1976-08-10 1978-03-10 Thomson Csf Dispositif a elements semiconducteurs pour la visualisation d'un signal electrique
JPS543483A (en) * 1977-06-10 1979-01-11 Hitachi Ltd Liminous semiconductor device
US4167016A (en) * 1977-09-21 1979-09-04 International Business Machines Corporation Optically isolated monolithic light emitting diode array
US4199385A (en) * 1977-09-21 1980-04-22 International Business Machines Corporation Method of making an optically isolated monolithic light emitting diode array utilizing epitaxial deposition of graded layers and selective diffusion
US4211586A (en) * 1977-09-21 1980-07-08 International Business Machines Corporation Method of fabricating multicolor light emitting diode array utilizing stepped graded epitaxial layers
US4163920A (en) * 1977-09-26 1979-08-07 Ford Motor Company Solid state source of radiant energy having a controllable frequency spectra characteristic
US4181405A (en) * 1978-08-07 1980-01-01 The Singer Company Head-up viewing display
US5184114A (en) * 1982-11-04 1993-02-02 Integrated Systems Engineering, Inc. Solid state color display system and light emitting diode pixels therefor
FR2554606B1 (fr) * 1983-11-04 1987-04-10 Thomson Csf Dispositif optique de concentration du rayonnement lumineux emis par une diode electroluminescente, et diode electroluminescente comportant un tel dispositif
US4697202A (en) * 1984-02-02 1987-09-29 Sri International Integrated circuit having dislocation free substrate
EP0177560A1 (en) * 1984-03-22 1986-04-16 Mostek Corporation Integrated circuit add-on components
US4644342A (en) * 1984-03-29 1987-02-17 Eastman Kodak Company Array of light emitting diodes for producing gray scale light images
FR2584520B1 (fr) * 1985-07-03 1990-06-08 Sayag Electronic Dispositif d'affichage comportant un reseau matriciel de sources lumineuses
US5122733A (en) 1986-01-15 1992-06-16 Karel Havel Variable color digital multimeter
US5561365A (en) 1986-07-07 1996-10-01 Karel Havel Digital color display system
JPH0326536Y2 (ja) * 1986-10-01 1991-06-07
US4831395A (en) * 1987-04-01 1989-05-16 Eastman Kodak Company Printer apparatus
US4941004A (en) * 1987-04-01 1990-07-10 Eastman Kodak Company Printer apparatus
DE58904033D1 (de) * 1988-02-19 1993-05-19 Siemens Ag Isoliereinrichtung zum optischen isolieren integrierter komponenten.
US4916530A (en) * 1988-09-02 1990-04-10 Itek Graphix Corp. High resolution halftone dot generator system including LED array
JP2790215B2 (ja) * 1988-10-31 1998-08-27 株式会社日立製作所 半導体集積回路装置
JP3069587B2 (ja) * 1988-11-01 2000-07-24 セイコーエプソン株式会社 多出力電流供給用集積回路及びそれを用いた複数の被駆動素子の駆動制御装置
US5206629A (en) * 1989-02-27 1993-04-27 Texas Instruments Incorporated Spatial light modulator and memory for digitized video display
JPH0316466A (ja) * 1989-06-14 1991-01-24 Sharp Corp 密着型イメージセンサ
US5339090A (en) * 1989-06-23 1994-08-16 Northern Telecom Limited Spatial light modulators
US5102824A (en) * 1990-11-05 1992-04-07 California Institute Of Technology Method of manufacturing a distributed light emitting diode flat-screen display for use in televisions
US5225823A (en) * 1990-12-04 1993-07-06 Harris Corporation Field sequential liquid crystal display with memory integrated within the liquid crystal panel
US5369416A (en) * 1992-06-17 1994-11-29 Indikon Company, Inc. Multi-color bargraph
US5482896A (en) * 1993-11-18 1996-01-09 Eastman Kodak Company Light emitting device comprising an organic LED array on an ultra thin substrate and process for forming same
US5973396A (en) 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
US6414662B1 (en) 1999-10-12 2002-07-02 Texas Digital Systems, Inc. Variable color complementary display device using anti-parallel light emitting diodes
US6486499B1 (en) * 1999-12-22 2002-11-26 Lumileds Lighting U.S., Llc III-nitride light-emitting device with increased light generating capability
US6885035B2 (en) * 1999-12-22 2005-04-26 Lumileds Lighting U.S., Llc Multi-chip semiconductor LED assembly
US6798931B2 (en) * 2001-03-06 2004-09-28 Digital Optics Corp. Separating of optical integrated modules and structures formed thereby
US6547249B2 (en) 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
JP3659407B2 (ja) * 2001-08-03 2005-06-15 ソニー株式会社 発光装置
DE10253440A1 (de) * 2002-11-12 2004-05-27 Infineon Technologies Ag Planare optische Schaltung
US7015825B2 (en) * 2003-04-14 2006-03-21 Carpenter Decorating Co., Inc. Decorative lighting system and decorative illumination device
US20040206970A1 (en) * 2003-04-16 2004-10-21 Martin Paul S. Alternating current light emitting device
KR20060090680A (ko) * 2003-10-03 2006-08-14 코닌클리케 필립스 일렉트로닉스 엔.브이. 동적으로 조명된 제품 디스플레이 시스템 장치 및 방법
US9071809B2 (en) * 2008-01-04 2015-06-30 Nanolumens Acquisition, Inc. Mobile, personsize display system and method of use
US8476844B2 (en) * 2008-11-21 2013-07-02 B/E Aerospace, Inc. Light emitting diode (LED) lighting system providing precise color control
CN103311261B (zh) * 2013-05-24 2016-02-17 安徽三安光电有限公司 集成led发光器件及其制作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48103185A (ja) * 1972-04-10 1973-12-25

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US3388292A (en) * 1966-02-15 1968-06-11 Rca Corp Insulated gate field-effect transistor means for information gating and driving of solid state display panels
US3617823A (en) * 1969-03-07 1971-11-02 Rca Corp Self-scanned phototransistor array employing common substrate
US3781515A (en) * 1969-08-08 1973-12-25 Texas Instruments Inc Integrated heater element array and drive matrix
US3668688A (en) * 1969-12-29 1972-06-06 Owens Illinois Inc Gas discharge display and memory panel having addressing and interface circuits integral therewith
US3737704A (en) * 1971-10-27 1973-06-05 Motorola Inc Scannable light emitting diode array and method
US3817798A (en) * 1971-11-19 1974-06-18 Ibm Method of forming integrated semiconductor devices with iii-v compounds
JPS5310840B2 (ja) * 1972-05-04 1978-04-17
US3846193A (en) * 1972-06-22 1974-11-05 Ibm Minimizing cross-talk in l.e.d.arrays
US3783353A (en) * 1972-10-27 1974-01-01 Rca Corp Electroluminescent semiconductor device capable of emitting light of three different wavelengths
US3807037A (en) * 1972-11-30 1974-04-30 Us Army Pocketable direct current electroluminescent display device addressed by mos and mnos circuitry
US3807036A (en) * 1972-11-30 1974-04-30 Us Army Direct current electroluminescent panel using amorphus semiconductors for digitally addressing alpha-numeric displays

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48103185A (ja) * 1972-04-10 1973-12-25

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5398180U (ja) * 1977-01-11 1978-08-09
JPS55165729A (en) * 1979-06-13 1980-12-24 Unitika Ltd Excretion treatment of pig
JPS56126983A (en) * 1980-03-12 1981-10-05 Oki Electric Ind Co Ltd Semiconductor light emitting device

Also Published As

Publication number Publication date
CA1050644A (en) 1979-03-13
US3947840A (en) 1976-03-30

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