JPS5148974A - - Google Patents

Info

Publication number
JPS5148974A
JPS5148974A JP49123240A JP12324074A JPS5148974A JP S5148974 A JPS5148974 A JP S5148974A JP 49123240 A JP49123240 A JP 49123240A JP 12324074 A JP12324074 A JP 12324074A JP S5148974 A JPS5148974 A JP S5148974A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49123240A
Other languages
Japanese (ja)
Inventor
Saburo Fukasaku
Masaki Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP49123240A priority Critical patent/JPS5148974A/ja
Publication of JPS5148974A publication Critical patent/JPS5148974A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP49123240A 1974-10-25 1974-10-25 Pending JPS5148974A (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49123240A JPS5148974A (enExample) 1974-10-25 1974-10-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49123240A JPS5148974A (enExample) 1974-10-25 1974-10-25

Publications (1)

Publication Number Publication Date
JPS5148974A true JPS5148974A (enExample) 1976-04-27

Family

ID=14855657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49123240A Pending JPS5148974A (enExample) 1974-10-25 1974-10-25

Country Status (1)

Country Link
JP (1) JPS5148974A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196536A (en) * 1981-05-28 1982-12-02 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS583035U (ja) * 1981-06-29 1983-01-10 富士通株式会社 樹脂モ−ルド用の型
JPS5827326A (ja) * 1981-08-11 1983-02-18 Japan Steel Works Ltd:The Ｉｃチツプの樹脂封止方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831388A (enExample) * 1971-08-27 1973-04-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831388A (enExample) * 1971-08-27 1973-04-24

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196536A (en) * 1981-05-28 1982-12-02 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS583035U (ja) * 1981-06-29 1983-01-10 富士通株式会社 樹脂モ−ルド用の型
JPS5827326A (ja) * 1981-08-11 1983-02-18 Japan Steel Works Ltd:The Ｉｃチツプの樹脂封止方法

Similar Documents

Publication Publication Date Title
FI751275A7 (enExample)
DK56474A (enExample)
FI752848A7 (enExample)
FI264774A7 (enExample)
JPS5148974A (enExample)
FI752140A7 (enExample)
DK344275A (enExample)
DE2426077A1 (enExample)
AR198786Q (enExample)
BG20027A1 (enExample)
BG19890A1 (enExample)
DD118649A5 (enExample)
CH601371A5 (enExample)
CH601130A5 (enExample)
CH590713B5 (enExample)
BG20446A1 (enExample)
BG20432A1 (enExample)
BG20160A1 (enExample)
BG20151A1 (enExample)
BG20144A1 (enExample)
BG20062A1 (enExample)
AU481545A (enExample)
BG20054A1 (enExample)
BG20028A1 (enExample)
BG19872A1 (enExample)