JPS5128497B2 - - Google Patents

Info

Publication number
JPS5128497B2
JPS5128497B2 JP47000090A JP9072A JPS5128497B2 JP S5128497 B2 JPS5128497 B2 JP S5128497B2 JP 47000090 A JP47000090 A JP 47000090A JP 9072 A JP9072 A JP 9072A JP S5128497 B2 JPS5128497 B2 JP S5128497B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47000090A
Other languages
Japanese (ja)
Other versions
JPS4873077A (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47000090A priority Critical patent/JPS5128497B2/ja
Publication of JPS4873077A publication Critical patent/JPS4873077A/ja
Publication of JPS5128497B2 publication Critical patent/JPS5128497B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Dicing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP47000090A 1971-12-29 1971-12-29 Expired JPS5128497B2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47000090A JPS5128497B2 (enExample) 1971-12-29 1971-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47000090A JPS5128497B2 (enExample) 1971-12-29 1971-12-29

Publications (2)

Publication Number Publication Date
JPS4873077A JPS4873077A (enExample) 1973-10-02
JPS5128497B2 true JPS5128497B2 (enExample) 1976-08-19

Family

ID=11464408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47000090A Expired JPS5128497B2 (enExample) 1971-12-29 1971-12-29

Country Status (1)

Country Link
JP (1) JPS5128497B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106672U (enExample) * 1977-02-01 1978-08-26
JPH02100340A (ja) * 1988-10-06 1990-04-12 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS4873077A (enExample) 1973-10-02

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